AmkorTechnology Amkor Technology, Inc.

Job Summary:

  • Plan and execute equipment capability, control, monitoring and improvement
  • Prepare and control proper equipment documents and documentation system
  • Plan and improve equipment output yield and quality
  • Support process productivity and efficiency improvement activities
  • Plan and do effective product and process analysis
  • Plan and do effective equipment and process training
  • Plan and monitor the equipment PM effectiveness
  • Involvement in cost savings project


  • Hands-on knowledge in semiconductor manufacturing processes, such as dicing, die attach, clip bond, encapsulate, trim & form, mark, and test processes
  • Experience in Assembly and Test at semiconductor packaging
  • Knowledge of QFN package/Flip chip assembly is desirable
  • Experience in bringing a product from Low Volume to High Volume production
  • Good written and verbal communication skills. Able to present ideas, concepts, data and plan with high confidence at team meetings and executive review meetings
  • Able to perform independently with minimal supervision


  • Degree or master in either mechanical, electronics, manufacturing engineering, materials engineering or similar disciplines
  • Minimal of 2 years of semiconductor manufacturing

Interested candidates can send their CV to [email protected]