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AmkorTechnology Amkor Technology, Inc.

Job Summary:

Responsible for completing package designs (leadframe/laminate/WLCSP & Bumping product) and associated support documentation. To partake in daily communications with customers, factory personnel, suppliers, and design/characterization team members to ensure the successful execution and completion of design projects and R&D support programs.

Duties & Responsibilities:

  • Responsible for completing package designs (leadframe/laminate/WLCSP & Bumping product)
  • Responsible for associated support documentation
  • To partake in daily communications with customers, factory personnel, suppliers, and design/characterization team members to ensure the successful execution and completion of design projects and R&D support programs
  • Other duty assigned by supervisor

Travel Required:

  • Domestic 5% International 0%

Qualifications:

  • Bachelor’s degree, related in Engineering major
  • More than one year working in semiconductor process field
  • Know about the relative basic semiconductor package procedure
  • Computer operation skill and design tool
  • Good verbal and written English communications are required for interactions with external and internal customers