Amkor Technology

Enabling The Future

Amkor is currently seeking a VP, Power Products for our Tempe, AZ office. The primary function of this position is program management for development of packaging for the Wirebond and Power business unit focusing on analog, microcontroller and the power electronics market segments. This person will be a primary interface with Tier 1 customers and Amkor’s leading edge R&D center in South Korea.

  • Drive and coordinate development activities with customers and Amkor’s development teams
  • Lead Tier 1 customer meetings, discussions and follow-ups during project development for wire-bonded packages, leadframe packages and power packages
  • Coordinate and collaborate with all company resources as are required to execute R&D projects that will exceed all customer requirements
  • Manage and lead cross-functional teams comprised of design center and characterization resources to optimize novel designs and to establish design rules for new IC package families
  • Manage product management through initial production ramp


  • This position requires a Bachelor’s degree in Engineering (Mechanical, Chemical, or Materials Science)
  • 15+ years of experience in semiconductor packaging development is required, a minimum of 13+ years with a PhD
  • The qualified candidate will be able to work independently in a global organization with demonstrated experience in IC package process development
  • The qualified candidate understand the IC package design environment, and tradeoffs associated with package design during package process development
  • Direct previous product management experience involving off-shore process development is highly desired
  • Deep knowledge of IC packaging materials, failure mode and reliability qualification procedures is required
  • Demonstrated, effective leadership skills and capabilities
  • Excellent written and verbal communication, presentation skills required
  • This position requires 20% domestic and 20% international travel
  • Working knowledge of IC IO drivers and associated electrical interactions and trade-offs with different IC packaging technologies is desired
  • Knowledge of thermal or mechanical simulations and modeling is desired
  • Familiarity with Design of Experiments and Statistical Process Control and adeptness with the creation of product marketing collateral is a plus
  • Customer product roadmap translation to IC packaging development roadmap is preferred