Director, Chiplets/FCBGA Integration

Amkor is currently seeking a Director, Chiplets/FCBGA for our Tempe, AZ office. The primary function of this position is program management for development of advanced chiplet-based modules such as HDFO (High Density Fan-out) and other advanced IC package constructions for computing, networking and PC client market spaces. This person will be the primary interface with Tier 1 customers and Amkor’s leading edge R&D center in South Korea.

• Drive and coordinate development activities with customers and in conjunction with Amkor’s development teams in Korea.
• Lead Tier 1 customer interface meetings, discussions and follow-ups during project development.
• Coordinate and collaborate with all company resources as are required to execute R&D projects that will exceed all customer requirement.
• Manage cross functional teams comprised of design center and characterization resources as well as process development in R&D, to optimize novel designs and to establish design rules for new IC package families.
• Manage product management through initial production ramp.

Required Qualifications:

• This position requires a Bachelor’s degree in Engineering (Mechanical, Chemical, or Materials Science); Master’s degree is preferred.
• 12+ years of experience in semiconductor packaging development is required, a minimum of 10 years with a Master’s degree.
• The qualified candidate will be able to work independently in a global organization with demonstrated experience in IC package process development.
• The qualified candidate understands the IC package design environment, and trade-offs associated with package design during package process development for FCCSP and FCBGA packages.
• Direct previous product management experience involving off-shore process development is highly desired.
• Deep knowledge of IC packaging materials, failure mode and reliability qualification procedures is required.
• Excellent written and verbal communication skills needed.
• This position requires 20% domestic and 20% international travel.

• Expertise in Fan-out IC Packaging, including Low density (LDFO), and high density (HDFO) is a plus.
• Expertise in large body FCBGA packaging: warpage control, stress management, underfill and TIM materials is a plus.
• Working knowledge of semi-additive plating chemistries and equipment is desired.
• Knowledge of thermal or mechanical simulations and modeling and insight derived from these is preferred.
• Familiarity with Design of Experiments and Statistical Process Control and adeptness with the creation of product marketing collateral is a plus.