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Amkor Technology

Enabling The Future

Amkor is seeking a Product Engineer preferably with experience in IC package development, with an emphasis on fcCSP technologies across the various package types (Package On Package, Hybrid-fcCSP, automotive-oriented fcCSP and etc.). This position will manage the product development from inception through final product qualification and production launch. This position is based in the Amkor corporate office in Tempe, AZ.

  • Work closely with customer teams to understand the assembly, reliability and scheduling requirements for various new package configurations and product introductions.
  • Daily application of knowledge of semiconductor packaging assembly and substrate technologies across many concurrent development / New Product Introduction (NPI) programs.
  • Promote Amkor package technologies directly to new and existing customers to find potential applications, deploying the flip chip package portfolio with key customers to gain business.
  • Work with factory teams to create detailed package/process risk assessments for the manufacturability and reliability of NPIs, including highlighting areas of customer requirements that drive cost and implementing mitigation plans to control them.
  • Create and maintain detailed cost analysis on package types, process flows, and customer product Request for Quotes (RFQs) as well as provide detailed pricing inputs to management and sales on customer package engineering programs.
  • Establish/maintain supplier chains from beginning to end in packaging field (bumping, probe test, assembly, and final test).

QUALIFICATIONS:

  • Bachelor’s Degree in science or engineering.
  • Entry level opportunity with prior, relevant internship or professional experience a plus.
  • Strong technical background with knowledge of problem-solving skill required.
  • Relevant experience in a technical or business capacity in the manufacturing, distribution industries with semiconductor industry as highly preferred.
  • Demonstrated ability to work independently, self-motivated and perform hands on engineering tasks.
  • Proficiency in Excel, PowerPoint, and other MS Office software.
  • Excellent communication and presentation skills, across levels, including working across functional groups as well as cross-culturally.
  • Fluency in the Korean or Chinese language is highly desirable.
  • Knowledge in semiconductor packaging or similar manufacturing is desirable.
  • Industrial Engineering course study or focus beneficial.
  • Experience/knowledge with mechanical test, material property test, reliability test, failure analysis is a plus.
  • Ability to work in a world-wide diverse work environment is a plus.