Amkor is recruiting for a Business Unit (BU) Product Management position for Advanced FCBGA Packaging in Tempe, AZ, where the primary function of this position is program management and to manage key customer accounts. Additionally, the position will drive internal process development and co-development programs in support of customers, off-shore factories and supplier development teams while supporting the qualification and mass production of FCBGA products. This individual will manage multiple day to day activities through internal management systems, as well as support existing customers.
- Partner with BU members to achieve annual goals, while managing customer relationships to grow market share.
- Promote Amkor package technologies directly to new and existing customers to find potential applications, deploying the flip chip package portfolio with key customers to gain business.
- Work closely with customer teams to understand the assembly, reliability and scheduling requirements for various new package configurations and product introductions. To include: substrate design, silicon to package interconnects, product assembly material selections, and manufacturing process requirements.
- Create detailed package/process risk assessments for the manufacturability and reliability of NPIs, including highlighting areas of customer requirements that drive cost and implementing mitigation plans to control them.
- Work closely with customer package engineering and Amkor factory engineering to understand/characterize prototype build plans; enabling successful qualifications and robust, on-time manufacturing production ramps. This will include assisting the team in designing experiments, analyzing factory build data, supporting root cause failure analysis investigation, and managing corrective action pathways to resolution.
- Create and maintain detailed cost analysis on package types, process flows, and customer product RFQs as well as provide detailed pricing inputs to Management and Sales on customer package engineering programs.
- Work with Amkor advanced product development teams on the transfer of new packaging technologies to production. This will include supporting cost analysis, CapEx requirements, manufacturability assessments, and program management through final qualification and initial production ramp.
- Work within the team to foster the development of product roadmaps, marketing strategies and business plans for continued growth in both existing and emerging markets.
Qualifications:
- This position requires a Bachelor’s degree in Engineering (Mechanical, Chemical, Electrical, Industrial, Materials Science or other relevant disciplines).
- 7+ years of demonstrated industry experience required, with semiconductor packaging experience required. Additional, relevant experience may be considered for Director level.
- Familiarity with Design of Experiments and Statistical Process Control is needed.
- Previous project management experience is a required.
- Knowledge of material and package characterization data analysis, test methods and qualification procedures are required.
- Strong understanding of wafer bump, assembly processes and techniques is necessary.
- Proven ability to multiplex across numerous programs and teams is essential. Experience working with offshore factories is a plus.
- Demonstrated self-drive and motivation to adapt and overcome obstacles across a multi-faceted, dynamic, and fast-paced environment. Ability to work independently in a heavily matrixed organization.
- Requires excellent, demonstrated written and verbal communication skills.
- Proficiency with Microsoft Office (Excel, PowerPoint, Outlook) is required.
- This position can require up to 10% travel.
- Experience with cost modeling, pricing, quoting activities and products is very beneficial.
- Flip Chip package design and OSAT experience will be a plus.
- Experience working with external customers is highly preferred.
