Amkor Technology

Enabling the Future

Amkor is recruiting for a Sr. Manager, Wafer Services Business Unit to be based at Amkor’s corporate headquarters in Tempe, AZ. This position will be a customer facing role with significant customer interaction on a day-to-day basis to help drive new revenue. This position includes cross functional management and direct customer interactions for new product development, qualification and mass production of wafer bumping, wafer level CSP, wafer level fan out, wafer probe and die processing. The position will include technical, capacity, CapEx, and commercial discussions. Regular statistical analysis of various data sets will be required. Daily interaction with Amkor Sales team and Factory teams will be needed to manage customer expectations and requirements.

This role combines technical knowledge, project management, strategic planning, tactical execution, customer satisfaction control, business sense, and negotiation skill. The selected individual will need to manage ownership of multiple programs, from both business and technical sides.

• Promote Amkor package technologies directly to new and existing customers to find potential applications, deploying the package portfolio with key customers to gain business
• Proactively drive year-over-year customer revenue growth both within this business unit and within Amkor
• Create detailed package/process risk assessments for the manufacturability and reliability of NPIs, including highlighting areas of customer requirements that drive cost and implementing mitigation plans to control them
• Conducting deep dive statistical analyses of cost and factory data to identify areas of optimization
• Work closely with customer package engineering and Amkor factory engineering to understand / characterize prototype build plans; enabling successful qualifications and robust, on-time manufacturing production ramps; this will include assisting the team in designing experiments, analyzing factory build data, supporting root cause failure analysis investigation, and managing corrective action pathways to resolution
• Create and maintain detailed cost analysis on package types, process flows, and customer product RFQs as well as provide detailed pricing inputs to Management and Sales on customer package engineering programs
• Work within the team to foster the development of product roadmaps, marketing strategies and business plans for continued growth in both existing and emerging markets
• This position will have capacity and planning discussions with customers
• Perform technical deep dives in WLCSP and Wafer Level Processes (Wafer bumping, CuP, WLFO, Lead Free, Probe, Die Processing, etc.)
• Being collaborative and having an optimistic, can-do attitude on a daily basis is essential

Required Qualifications:

• Bachelor’s Degree in Engineering (or related) with minimum of 8 years’ experience in semiconductor manufacturing or packaging
• Exhibit organized technical Project Management experience (preferably, involving off-shore factories) and the ability to multiplex across numerous programs and teams is essential
• Demonstrated ability to work independently in a heavily matrixed organization; needs to be self-driven and very motivated to adapt and overcome obstacles across a multi-faceted job role; assuming ownership of program success is a must
• Solid knowledge of semiconductor packaging design, materials, substrates, manufacturing methods and various wafer bumping
• Hands on semiconductor manufacturing / technical experience with wafer level packaging and/or die processing
• Previous experience in a customer facing business role
• Proven track record of driving customer revenue increases year-over-year
• Solid background and knowledge of statistical analysis
• Requires excellent written and verbal communication skills
• Frequent face to face and teleconference technical presentations to customers is required
• Proficiency with Microsoft Office (Excel, PowerPoint, Outlook) is required
• This position requires up to 10% domestic and international travel

• An advanced business degree is desired
• 6 Sigma black or green belt highly desired
• Knowledge of material and package characterization data analysis, reliability test methods and qualification procedures are desired