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Ansys

This engineer will join the Research and Development team that creates state of the art software for semiconductor analysis.
Innovation in semiconductor design and manufacturing enables smaller device architectures with higher performance and energy efficiency for powering the smart product revolution. The physics associated with shrinking geometries, especially in the emerging 3-D IC, FinFET and stacked-die architectures, bring out design challenges related to power and reliability, affecting design closure. ANSYS simulation and modeling tools offer the sign-off accuracy and performance needed to ensure proper timing and power noise integrity and reliability of even the most complex ICs, taking into account electromigration, thermal effects and electrostatic discharge phenomena.

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