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ANSYS

SUMMARY
This engineer will join the Research and Development team that creates state of the art software for semiconductor analysis.

Innovation in semiconductor design and manufacturing enables smaller device architectures with higher performance and energy efficiency for powering the smart product revolution. The physics associated with shrinking geometries, especially in the emerging 3-D IC, FinFET and stacked-die architectures, bring out design challenges related to power and reliability, affecting design closure. ANSYS simulation and modeling tools offer the sign-off accuracy and performance needed to ensure power noise integrity and reliability of even the most complex ICs, taking into account electromigration, thermal effects and electrostatic discharge phenomena.

 

RESPONSIBILITIES

Demonstrate a solid understanding of the code and the team’s software development processes.
Work with manager and others to define and implement new capabilities.  Once projects are defined, the engineer should be able to deliver medium sized projects with minimal input from others.
Diagnose and fix code problems.
Deliver code that meets requirements on schedule.  Ensure that code is efficient, scalable, maintainable, extensible, robust and easy to understand.
Optimize code to improve tool run time and memory capacity.
Create unit, regression and/or system-level tests to thoroughly validate new features or changes.
Communicate clearly and work closely with manager, technical leads and other engineers to refine solutions and to describe changes that may affect others.
Understand and demonstrate best practices in software engineering.
Be a source of expertise for others in the project team.

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