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ASE Group

Work with multinational IC packaging and testing services provider’s customers to manage new product development and implement new product introduction from package design, bill of materials, engineering and qualification, product liability, process/package characterization, to production ramp. Engage with customers from package design stage to meet with application requirement for state of the art high speed, high performance and mobile electronic product environments; manage new projects from the prototype, IC assembly, quality control, quality assurance process to mass production. Help customers in high-speed IC packaging design by utilizing company’s latest IC packaging design rule and manufacturing process. Work with company’s cross-country, cross-functional teams to establish plan and key milestone for the technical program and to meet and deliver the program objective. Provide engineering support to customer to achieve optimal IC packaging solutions.

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