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This position is Field Application Engineer supporting customer on Radio Frequency (RF) product development, including WiFi/BT/UWB/5G/ etc, by owning program management on IC packaging, Module/PCB design, RF tuning, assembly and test. The person needs knowledge in semiconductor IC packaging technology, substrate design, process, test and failure analysis. RF IC/package product experience, hardware design, component selection, tuning and test is plus. Work directly with IC and OEM customer.

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