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As an Application Engineer you will have the exciting opportunity to work closely with customers supporting technical campaigns by delivering product demonstrations, knowledge transfer, training and onsite support. This will involve working with packaging of electronics using highly integrated IC package co-design and multi-die chiplet methodologies. The candidate should have knowledge of standard IC packaging methods including wirebond, flipchip , interposer technology and design implementation techniques supporting high speed technologies. Knowledge with the latest trends  and the advancement of Heterogenous Integration applications  is a plus

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