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Infineon

Job description
Develop ATE test solutions for highly integrated RF SoC ICs for Wireless connectivity devices.
Interface with cross functional Design and DFT, PMU, RF DVT teams to develop and present test plans.
Design and debug the required device interface boards (DIB) and test program to be used for device characterization, qualification, and production
Partner with Product Engineering for product characterization and Reliability testing.
Responsible for optimizing test time and yield of the Final Test Program for both FE and BE production releases.
Responsible for building multiple sets of correlated production DIBs and transferring to offshore manufacturing sites (OSATs)
Resolve early production as well as mass production issues.
Provide on-going support for Test Program enhancements as needed to ensure high quality and cost-effective manufacturing throughput
Work with cross functional engineering teams in failure analysis and defining corrective actions, ensuring ongoing production quality
Builds peer to peer relationships with cross functional teams

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