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Infineon

As a Principal Engineer for Package Concept Engineering, you will work on high-voltage discrete package concepts for Wide Band Gap technologies (CoolGaN HEMT and CoolSiC Trench MOSFET) as well as on integrated CoolGaN power stages or system in package solutions, which are becoming more and more established in the market. With your technical expertise you can shape Infineon’s strategic direction and thereby strengthen Infineon’s position in the market.

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