This represents an excellent opportunity for an engineer wishing to start their career in a field-based role on key 300mm Advanced Packaging applications and 200mm Si, dielectric and GaN etch applications.


Your main responsibility will be to provide onsite process development support on SPTS plasma etch and deposition modules, based at IMEC’s state-of-the art facility as part of a 4-yr joint development programme on Advanced Packaging, GaN and BioMEMs.  You will work closely with the Field Applications Manager to develop novel plasma etch and deposition processes to meet both the needs of imec and future SPTS applications.


Your work will also involve generating and trialing new hardware concepts, modelling with commercial simulation software package, as well as carrying out hands-on process development and hardware testing. Additional responsibilities will include advising customers on system performance, preparing reports and technical notes, presenting data at IMEC technical review seminars and building successful customer relationships.  Good inter-personal skills should complement the ability to work with a high degree of autonomy.

This position will involve frequent travel to UK to participate in technical review meetings at SPTS .

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