The Broadband Plasma Division (BBP) provides market-leading patterned wafer optical inspection systems for leading-edge IC manufacturing. Logic, foundry, and memory customers depend on BBP products to detect yield-critical defects for process debug and excursion monitoring at advanced process nodes. BBP flagship products include the 29xx and 39xx series which leverage Broadband Plasma technology to capture a wide range of defects with ultimate sensitivity at the optical inspection speeds needed for inline defect monitoring.


Responsibilities for this exciting role will include:

Managing resource allocations, schedules, and project budgets
Create training plans for the development of team members
Work with suppliers worldwide to develop complex, cost-effective, and reliable solutions for next-generation HPC systems
Understand and drive system, sub-system, and interface requirements
Propose and lead feasibility studies and proof of concepts
Guide engineering team in HPC system designs
Guide the development of new features to continuously improve existing products
Collaborate with cross-functional teams, including Mechanical Engineering, Software Engineering, Systems Engineering, supply chain organizations, etc. and lead system-level discussions including impact on overall system performance

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