Set up recipes for Pattern Wafer Geometry inspection to study the wafer shape and curvature changes post process deposition. Set up optimized recipe conditions using the appropriate metrics to study and flag the shape/curvature changes and stress variations due to process variations. Optimize fabrication processes to obtain better yield. Enhance identification and control-yielding impacting events and processes during the patterned wafer stage. Employ data processing tools to study and examine the curvature and the shape variations.

Minimum Qualifications

Master’s Degree in Material Science, Electrical Engineering, Mechanical Engineering, Data Science, Optics, Physics or a related field and 2 years of experience in the position offered or in an engineering-related occupation.


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