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The Broadband Plasma Division (BBP) provides market-leading patterned wafer optical inspection systems for leading-edge IC manufacturing. Logic, foundry, and memory customers depend on BBP products to detect yield-critical defects for process debug and excursion monitoring at advanced process nodes.

BBP flagship products include the 29xx and 39xx series which leverage Broadband Plasma technology to capture a wide range of defects with ultimate sensitivity at the optical inspection speeds needed for inline defect monitoring.

Responsibilities

The selected Product Development Engineer will work on Broadband Plasma products. This role will involve requirements analysis, systems design and testing of complex inspection systems and subsystems using expertise from multiple technical disciplines. The selected candidate will:

Work with marketing and engineering to develop detailed requirement specifications and test plans for new products and features – 30%
Work with functional groups to define and review designs. Create and execute test plans and perform analysis to validate system performance. Will trouble shoot system and subsystem issues and work with various subsystem teams to find and implement solutions – 40%
Support internal and external customers in implementing processes to build and use the tool effectively and optimize tool performance. Lead troubleshooting efforts in manufacturing and in the field. – 30%
Occasional travel will be required.

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