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Lam Research

This Electrical Engineering position reports to Deposition Product Group. Responsible to develop equipment used to deposit thin metal films. Equipment designed and developed by this group is used in the manufacturing process of every integrated circuit made today. Electrical Engineers design equipment with the following subsystems: Heater control, Pressure control, 3 phase power delivery, DC power delivery, Cable harness development, Analog control, Digital control, EtherCAT, RS232, embedded controls, RF power delivery, filter development, integration of motion control, safety certification and creation of Software functional specifications

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