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Maxim Integrated

The candidate will be responsible for the following:

Review and compile classification of defects identified during semiconductor manufacturing processes.
Define and maintain relevant defect matrixes for product performance, reliability, and yield.
Analyze semiconductor wafer data for patterns and signatures.
Design and maintain SPC charts for excursion detection and control.
Look out for possible excursions during wafer processing.
Real-Time Analysis of Inline fab data on defects, tool status, commonality, and RCA.
Required to be hands-on in the day-to-day review of information, evaluation of defect monitoring strategies, and understanding of defect mechanisms with the mindset of making a difference.
Perform root cause analysis for low yields using various advanced data analysis tools

and more…

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