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Rambus

Rambus is looking for an experienced IC package design engineer in the Systems Engineering team of IP Cores BU. The suitable candidate will be involved through the design and development phase of both high-speed complex SerDes and Memory IP PHY development as well as semiconductor product chips. You will work closely with die floor-planning and physical design teams to complete package/interposer route feasibility studies for the targeted applications considering the form-factor, cost and performance. You will be responsible for developing the die level bump-out and the package level pin-out and the overall package design, development and manufacturing. You will also be responsible for the analyzing this database and ensuring that it meets the electrical signal and power integrity requirements. You will document the design and release package design guideline.

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