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Siemens Industry Software Inc.

Mentor Graphics is now Siemens EDA

Siemens EDA is a global technology leader in Electronic Design Automation, providing software and hardware design solutions that help engineers around the world create new and innovative products. Each year, our customers use our technologies and tools to push their design and development boundaries in order to deliver smaller, faster and more reliable products.

The 3D-IC Technical Lead role will be responsible for supporting the implementation of the strategy to achieve specific business targets and strategic objectives for the Siemens EDA advanced 2D, 2.5D, and 3D IC packaging offerings across the globe.

The 3D-IC tech lead will work along with the advanced packaging AE team, other field AE teams, and the 3D-IC Solutions Architect to help define, develop, test, and demonstrate cross-platform planning, implementation and signoff workflows for the proposed 3D-IC packaging solutions.

As part of this role, the 3D-IC tech lead is responsible for assisting in the definition and implementation of the technical solutions and workflows that are needed to develop a comprehensive leading-edge 3D-IC solutions. These tools and workflows are meant to cover all aspects of the solution set pulling in technology and resources across of the DISW product portfolios. This includes architecture exploration, planning, design implementation, design verification, design signoff analysis (signal integrity, power integrity and STA), reliability/manufacturability analysis (thermal, mechanical stress and DFM), and support for DFT device testing. The 3D-IC tech lead along with the solutions architect will provide guidance to any additional AE or intern resources brought on to help develop these flows, including but not limited to some project management, resources planning and management, and schedule development, etc.

To support the implementation and validation of these 3D-IC solutions, the 3D-IC tech lead will run the tools and workflows on internally developed and/or customer reference designs. Demonstrations and marketing collateral will be developed on these reference designs highlighting key aspects of the 3D-IC solutions to facilitate internal/customer training and support the adoption by new and existing customers. In addition, the 3D-IC tech lead will provide critical field intelligence back into the various software BUs based on the workflow development effort and user feedback in an effort to make sure the product directions and roadmaps are aligned with the customer needs.

The initial focus for this role will require close engagement with customers such as Intel, AMD, Qualcomm, and other customers including the US Gov and DARPA. For these accounts, the 3D-IC tech lead will be recognized as a key go-to technical AE resource to lead opportunities that are focused on teams designing and developing advanced IC packages and heterogeneous systems.

Responsibilities Include:
Assist in the implementation and rollout and deployment of the overall advanced packaging product strategy focused on 3D-IC along with the field technical management to achieve business targets and strategic objectives based on WW Sales and BU needs. Business targets and strategic objectives are defined by WW Sales in conjunction with the BU.
• Define technical account engagement plans and campaigns necessary to achieve the results. The strategy and plans for each account must be approved by the Account Manager.
• Project planning, resource planning and management, schedule development.
• Build strong customer relationships to enable establishment of strategic relationships for Siemens EDA in product / technology
• Serve as the key field resource to summarize competitive threats and opportunities
• Collect and communicate customer feedback, competitive information, and general field intelligence into the product BUs with the goal of aligning product direction and roadmaps to the customer needs within the territory.

Job Qualification:
• BS Degree or equivalent
• 10+ years of related experience in advanced packaging planning, design, and implementation
• Financial understanding to enable positioning a technology solution at a business level
• Product, market, and industry expertise in advanced packaging technology
• Set appropriate expectations and decision criteria
• Excellent communication skills
• Ability to effectively work in a highly matrixed organization across account management, the field technical organization, and the business unit R&D and Marketing teams
• Professional customer presence

At Siemens we are always challenging ourselves to build a better future.  We need the most innovative and diverse Digital Minds to develop tomorrow’s reality.  Find out more about the Digital world of Siemens here:  www.siemens.com/careers/digitalminds

Where permitted by applicable law, Siemens may require employees to be fully vaccinated against COVID-19 based on job requirements, and in accordance with an accommodation based on legally protected reasons.