中文 English

Synopsys

Responsible for package substrate design, from bump map creation to final package release to fabrication. Management/coordination of package design phases, schedule and flow, including required input/outputs from other teams. Model, simulate and analyze package substrate and PCB designs signal and power integrity wise. Organize, follow and maintain the package design development information and database files. Develop and document signal and power integrity best practices, requirements and flows for internal (and external) customer use.

For more & updated details, hit “Apply for job”