The Systems Solutions team at Synopsys is working on innovative EDA solutions for next generation cloud compute, AI, automotive and mobile semiconductor designs.  We are searching for an experienced thermal engineer to join the team and drive advanced solutions for thermal analysis and optimization to achieve maximum performance for advanced node, multi-die 3DIC chip/package designs.

Job Description:
You will be responsible for thermal modeling, analysis and optimization EDA solutions and tools for 3DIC (multi-die) designs at the chip, package and system levels.  You will collaborate with developers across multiple divisions and product groups working on design implementation and verification.
Your key responsibilities include: (a) Architecting solutions for early thermal estimation, detailed thermal analysis, and feedback to design architect and implementation engineers to enable them to achieve thermal integrity.  (b) Defining methodology and flows for emerging customer requirements, providing development requirements to R&D, providing ongoing technical support for new and existing customers. (c) Developing documentation and delivering training to proliferate your learnings and solutions.
You will collaborate closely with Synopsys Product and Field AEs, R&D software developers, Marketing, Sales, and customers.  You will develop and present technical papers/presentations at events and activities, such as SNUG and partner conferences.

For more details, hit “Apply for job”