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TDK InvenSense

Founded in 2003, InvenSense Inc., a TDK Group Company, is the world’s leading provider of MEMS sensor platforms. InvenSense’s vision of Sensing Everything™ targets the consumer electronics and industrial markets with integrated Motion and Sound solutions. Our solutions combine MEMS (micro electrical mechanical systems) sensors, such as accelerometers, gyroscopes, compasses, and microphones with proprietary algorithms and firmware that intelligently process, synthesize, and calibrate the output of sensors, maximizing performance and accuracy.  InvenSense’s motion tracking, audio and location platforms, and services can be found in many of the world’s largest and most iconic brands including smartphones, tablets, wearables, drones, gaming devices, internet of things, automotive products, and remote controls for smart TVs.

InvenSense is headquartered in San Jose, CA, and has offices in Boston, China, Taiwan, Korea, Japan, France, Canada, Slovakia, and Italy. We’re looking for top-notch innovators to join our global team. If you’re interested in being a part of our journey and helping us grow to become the leading provider of SoC platform solutions, we want to hear from you.

The Opportunity

Work within MEMS engineering team providing leadership in the areas of package design, packaging materials selection, and package assembly. You will be expected to explore new materials and new assembly methods in areas of MEMS packaging. The scope of work will include evaluation of design robustness, drawing technical conclusions, making appropriate recommendations to ensure the product conforms to engineering design intent, assembling prototypes, performing experimental testing, analyzing results in conjunction with statistics, tolerance analysis, FMEA. The job will also involve close interaction with overseas manufacturing houses, as well as close interactions with customers.

Position Qualifications:

MS or Ph.D. in Mechanical Engineering, Materials Science, Physics, or similar disciplines.
Broad material and fabrication knowledge and 5+ years of assembly process development experience in microelectronics
Knowledge of assembly processes, such as wafer grinding, dicing, die attach, die stacking with thin die, flip-chip, wire bond, encapsulation, underfill, molding, ball attach, gels for environmental protection, singulation. Open-cavity packaging experience is a plus.
Knowledge of JEDEC standards for package-level integrity/reliability stress tests requirements.
5+ years of experience with LGA, QFN, WLCSP, and flip-chip packages.  Knowledge of substrate & lead-frame materials, as well as manufacturing, is a plus.
5+ years of experience in supplier/OSAT managements, NPI, and HVM including quality improvements including technology-driven cost reduction.
Capably address MEMS/package interaction stress issues
Familiarity with computational FEM techniques for thermal and mechanical analysis and how they can be leveraged in package design and risk assessments
Working knowledge of statistical process control and statistical tolerance analyses
Knowledge of MEMS devices (e.g., accelerometer, gyrometer, pressure sensor, microphone, and magnetometer)
Expert in problem-solving/troubleshooting, and providing a solution
Ability to work in a fast-paced environment
Ability to travel internationally when needed