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Tokyo Electron (TEL)

The 3DI Process Technology Group at TTCA focuses on Heterogenous Integration R&D, including Wafer to Wafer (W2W) Fusion and Hybrid Bonding, TSV formation and Wafer Thinning for use in semiconductor manufacturing. We optimize the processes and hardware used to stack integrated circuits for advanced 3D applications including CMOS image sensors and memory devices. The Laser Process Engineer will be an integral part of the group working on developing advanced processes for wafer and die stacking technologies. This individual will provide process engineering support to ongoing development projects at TEL, in addition to identifying and developing novel processes in this rapidly evolving semiconductor space.

We have an opening for a Laser Process Engineer with expertise in laser physics and engineering. You will work with TEL’s suppliers to screen laser options for specific projects. You will need an understanding of semiconductor processes to specify, design, and oversee deployment of high-power lasers, and work to determine requirements, set specifications and address technology options.

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