Tokyo Electron (TEL)

Group/Role Overview:
The 3DI Process Technology Group at TTCA focuses on Heterogeneous Integration, including Wafer to Wafer (W2W) Fusion and Hybrid Bonding, BSPDN, TSV formation and Wafer Thinning for use in semiconductor manufacturing. We optimize the processes and hardware used to stack integrated circuits for advanced 3D applications including CMOS image sensors and memory devices.
The HI Principal Research Scientist will have broad expertise and/or unique knowledge in the field of 3DI/HI and use skills contribute to development of company objectives and principles and to achieve goals in creative and effective ways.

• Be an integral part of the 3DI team and work on significant and unique HI topics where analysis of situations or data requires an evaluation of intangibles.
· Develop new or modified processes necessary for high bond quality and scaling of hybrid bond interconnects.
· Exercise independent judgment in methods, techniques and evaluation criteria for obtaining results.
· Assist in recommendation and interpretation of physical and chemical behaviors as part of process characterization
· Document experiments and results for future reference
• Work with group engineers to propose criteria and format for hardware and process evaluations
· Compile and analyze process data from the evaluations to determine appropriate limits and variables for process or material specifications
• Act independently to determine methods and procedures on new or special assignments, and may supervise the activities of others.
• Create formal networks involving coordination among groups

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