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Tokyo Electron (TEL)

Responsibilities:
Provide support to engineers working on wafer bonding processes
Carry out advanced numerical simulations (ex: finite element or similar)
Optimize wafer bonding processes through use of experimental data and simulations
Work closely with cross-functional engineering teams to troubleshoot process/integration problems
Help to compile and analyze measured data
Working with engineers to develop recommendations and prepare changes, additions, and modifications, which will facilitate equipment production and sales

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