中文 English

Tokyo Electron (TEL)

The position in TEA CFL will involves the development and application of theory and simulation advanced plasma processes. Particular emphasis is on plasma physics/chemistry plasma surface interactions, simulation associated with precision plasma processes and the development of tools for the digital transformation of process and equipment development. Expertise in theory, plasma simulation and first principles methods associated with surface chemistry will be deployed to high value problems brought to CFL by the etch business unit and customers.

Responsibilities:
• Collaborate with other scientists and engineers to leverage the combination of digitally transformative tools (ML and AI) and fundamental plasma and materials science to accelerate process and equipment development for advanced (N+3) nodes.
• Responsibilities include early recognition of industry trends, identification of key patterning problems for future nodes, proposing novel patterning solutions, and developing/managing complex interdisciplinary projects
• Good communications skills are considered critical
• Communicate project goals and status both internally and externally at customer sites and conferences
• Publication in refereed scholarly journals and conferences as well as intellectual property generation is considered a must
• Some travel is required

‘For additional details and most recent updates, hit “Apply for job”