Website
Wolfspeed, A Cree Company

Job Description
Senior Process Development Engineer – Die Attach (Ipoh, Malaysia)

Responsibilities:

Bring package Innovation to the RF power packaging portfolio and contribute to the packaging roadmap for the Wolfspeed RF Power Division
Define and optimize of critical process parameters and validate their reliability
Design new customized tooling to adopt off the shelf equipment ( Datacon EVO, Palomar) for our high-volume production.
Support Development for GaN/SiC on Copper substrates for high power RF power applications.
Manage Development Milestone- and Feasibility Projects
Perform Die Attach Process development activities (Process parameters scouting, optimization, verification and Process Freeze) in Development projects to meet the project targets in term of timeline, quality, cost completeness and manufacturability.
Perform verification and qualification activities for new tooling, machines and materials in Development projects.
Responsible for technical handshake and knowledge transfer to Operation.
Maintain and provide inputs for updating of related documents and is responsible for their correct contents, eg Process of Record, Design Rule, Failure catalogue, Control Plan, Maintenance checklist, etc for development projects.

Requirements: 

BS, MS and PhD preferred in Mechanical, Chemical or Process Engineering or Applied Science
At least 8 years of experience in the Die-Attach Process engineering in a high technology semiconductor companies
Hands-on experience in developing Die attach process in a Package or Process Development or Product Engineering environment
Experience in high volume manufacturing, high power application and high RF power is preferred
Project Management Experience is a plus
Understanding of (Open Cavity) Packages for RF high power applications
Experience with SMT Assembly is a plus
Knowledge of Die Attach and Assembly equipment Datacon, Esec, ASM & Palomar.
Ability to provide good quality results under pressure and in a timely manner.
Highly motivated and must be able to work with minimum supervision.
Good analytical and problem solving, interpersonal, and communication skills.
Hands on experience on engineering methods such as FMEA, SPC, Pareto Analysis, Control Charts, 8D methodology and DoE.
Good interpersonal skills to interface with customers and support groups within Infineon
Business acumen to assess technical viability of solutions provided

Overview
At Cree, we’ve spent more than 30 years developing industry firsts as a leader in wide bandgap semiconductor technology. Not familiar with all of our products? That is because we are a part of the invisible revolution; if we do our job right you will never know we were there. Our products make impossible possible like our LEDs that power cities to our Silicon Carbide (SiC) and Gallium Nitride (GaN) components that power electric vehicles, solar energy, telecommunications and industrial, military and aerospace solutions.

We believe in enabling the world to do more with less. That’s why we encourage each other to think unconventionally, take ownership and solve real problems. Interested in a career at Cree? We want to meet you. Submit your application now.

We are an equal opportunity employer and all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, national origin, disability status, protected veteran status, or any other characteristic protected by law.