Wolfspeed | Cree

The primary focus of this position is to own the bond and grind process as a part of the backend wafer fabrication process.  The job is in Cree’s state of the art, highly automated, SiC Mohawk Valley Wafer Fab in New York.  The engineering team is expected to sustain processes to provide consistent device performance, yield, and quality, while also partnering with product integration, NPI, and R&D to ensure effective new product and process introductions.  A successful candidate will sustain the production line, while also driving projects to improve cycle time, tool availability, process/product yield, and drive cost reductions, and bring on next generation equipment in the Bond and Grind module.

For more details, hit “Apply for job”.