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Xilinx

Responsibilities:

•          Power integrity analysis for die package and PCB, which includes but not limited to layout extraction, electromagnetic and HSPICE simulation to meet silicon noise spec and decoupling strategy and analysis.

•          Simultaneous switching noise/output (SSN or SSO) analysis for I/O power domain.  Eye diagram and jitter analysis via Chip-package-board co-simulation.

•          Optimal layer stackup & power plane assignment to minimize voltage noise.

•          Special noise-sensitive power supply analysis and layout guideline.

and more…

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