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Acronyms

Commonly and not-so-commonly used acronyms.
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Description

The following is a list of acronyms and what they stand for:

ACK – Acknowledge
ADC - Analog to Digital Converter
AI - Artificial Intelligence
ALD - Atomic Layer Deposition
ALE - Atomic Layer Etch
AMOLED - Active-Matrix OLED
AMP - Asymmetric Multi Processing
AP – Access Point
ASIC - Application Specific Integrated Circuit
ATE - Automatic Test Equipment
BGA - Ball Grid Array
BSA – Basic Service Area
BTI - Bias-Temperature Instability
CA – Collision Avoidance
CBRAM - Conductive Bridging RAM
CCI - Cache Coherent Interconnect
CD Collision Detection
CF – Contention-Free
CFP – Contention-Free Period
CP – Contention Period
CPU - Central Processing Unit
CRC – Cyclic Redundancy Check
CSMA – Carrier Sense, Multiple Access
CFD - Computational Fluid Dynamic
CMOS - Complementary Metal Oxide Semiconductor
CNN - Convolutional Neural Network
CPP - Contacted Poly Pitch
CSP - Chip Scale Packaging
CTS – Clear To Send
DAC - Digital to Analog Convertor
DARPA - Defense Advanced Research Projects Agency
DCF – Distributed Coordination Function
DFA - Differential Fault Analysis
DFT - Design for Test
DFM - Design for Manufacturing
DIFS – Distributed Inter-frame Space
DPA - Differential Power Analysis
DRAM - Dynamic Random Access Memory
DRC - Design Rule Checker
DSA - Directed Self Assembly
DSP - Digital Signal Processor
DUT - Design Under Test
DUV - Design Under Verification
DVFS - Dynamic Voltage and Frequency Scaling
EDA - Electronic Design Automation
EM - ElectroMigration
ESL - Electronic System Level
EUV - Extreme Ultraviolet
FD-SOI - Fully Depleted Silicon on Insulator
FET - Field Effect Transistor
FIFO - First In First Out
FPGA - Field Programmable Gate Array
GAA - Gate-All-Around
GaAs - Gallium Arsenide
GaN - Gallium Nitride
GPU - Graphics Processing Unit
HBM - High Bandwidth Memory
HBT - Heterojunction Bipolar Transistor
HDL - Hardware Description Language
HMC - Hybrid Memory Cube
IC - Integrated Circuit
IEEE – Institute of Electrical and Electronics Engineers
IIC - Industrial Internet Consortium
IIoT - Industrial Internet of Things
IoT - Internet of Things
IP - Intellectual Property
IR – Infra-red
ISM – Industrial, Scientific, Medical
ISS - Instruction Set Simulator
ILT - Inverse Lithography Technology
JTAG - Joint Test Action Group
LAN – Local Area Network
LCD - Liquid Crystal Display
LTE - Long-Term Evolution
MAC –Media Access Control
MCU - Microcontroller
MEMS - Micro Electrical Mechanical Systems
MRAM - Magnetic Random Access Memory
NA - Numerical Aperture
NGL - Next-Generation Lithography
NIC – Network Interface Card
NSF - National Science Foundation
NVM - Non-Volatile Memory
OLED - Organic Light-Emitting Diode
OPC - Optical Proximity Correction
OS – Operating System
OSAT - Outsourced Semiconductor Assembly and Test
OTP - One Time Programmable
PCM - Printed Circuit Board
PCF – Point Coordination Function
PCM - Phase-Change Memory
PDK - Process Design Kit
PDN - Power Delivery Network
PHY – Physical Layer
PI - Power Integrity
PIFS – Point Inter-frame Space
PnR - Place and Route
PoP - Package-on-Package
PRNG - Pure Random Number Generator
PVT - Process, Voltage, Temperature
RC4 – Rivest Cipher 4
RDL - Register Definition Language
- Redistribution Layer
RF - Radio Frequency
ROM - Read Only Memory
RTL - Register Transfer Level
RTOS - Real Time Operating System
RTS – Request To Send
SCM - Storage Class Memory
SerDes - Serializer / Deserializer
SIFS – Short Inter-frame Space
SI - Signal Integrity
SiC - Silicon Carbide
SiGe - Silicon Germanium
SK – Shared Key
SMP - Symmetric Multi Processing
SoC - System on Chip
SOI - Silicon on Insulator
SPA - Simple Power Analysis
SRAF - Sub-Resolution Assist Features
SRAM - Static Random Access Memory
SSD - Solid-state Storage Drives
SSID – Service Set Identifier
STA - Static Timing Analysis
STI - Shallow Trench Isolation
TLM - Transaction Level Model
TSV - Through Silicon Via
UPF - Unified Power Format
USB - Universal Serial Bus
UVM - Universal Verification Methodology
VHDL - VHSIC Hardware Description Language
VHSIC - Very High Speed Integrated Circuit
VSLI - Very Large Scale Integration
VIP - Verification Intellectual Property
VoWi-Fi – Voice over Wi-Fi
Vt - theshold Voltage
Wan – Wide Area Network
WEP – Wired Equivalency Protocol
Wi-Fi – Wireless High Fidelity
WiGIG – Gigabit Wi-Fi
WLAN – Wireless Local Area Network
WLP - Wafer Level Packaging
WPA – Wi-Fi Protected Access


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