Blog Review: April 1


A Russian plan to build a massive cargo plane to deliver tanks at supersonic speed—A roll of tape coated in squid proteins provides perfect camouflage—A yacht made of volcanic fibers battling the world's roughest seas: Ansys' Justin Nescott finds everything for a James Bond movie in this week's top tech articles. Writing for Synopsys, Broadcom's Hari Balisetty looks at reusable sequences... » read more

Blog Review: March 25


From brain implants that recover memories to color-shifting shoes, Ansys' Bill Vandermark features sci-fi visions of the future that are becoming reality in his top five tech picks of the week. In the world of embedded software, is a black box better? Mentor's Colin Walls questions whether the advantages that come of having full access to source code outweigh the downsides. Cadence's Neel... » read more

Blog Review: March 18


How do you quantify effort spent in FPGA verification? Mentor's Harry Foster tackles the question in his latest installment of the Wilson Research Group functional verification study. A new frontier of design challenges is rapidly emerging, according to ARM CEO Simon Segars. Cadence's Brian Fuller brings us his keynote address at CDNLive. Synopsys' Tushar Mattu is back with more on AXI VI... » read more

The Week In Review: Design/IoT


Mergers & Acquisitions NXP added to its list of recent acquisitions with Athena SCS, a UK-based provider of embedded software and cryptography for smart cards and NFC. Lattice Semiconductor closed its all-cash $606.6 million acquisition of Silicon Image. Tools Cadence unveiled the Innovus Implementation System. The physical implementation tool sports massively parallel architect... » read more

Thermal Is Still Simmering


With the ever increasing sophistication in today’s high-performance [getkc id="81" kc_name="SoC"]s on top of sheer physics of device manufacturing, thermal is a much bigger concern than ever before. It is well understood that thermal and power are closely related, and there exists a vicious cycle between leakage power and temperature: leakage goes up, temperature goes up; temperature goes ... » read more

The Interconnected Web Of Power


Tradeoffs between area and timing used to follow fairly simple rules. You could improve timing by adding area, and occasionally find an architectural solution that would decrease both at the same time. With physical synthesis the relationship became a little more complicated because an increase in area, say to make a drive larger or add another buffer, might upset the layout. That, in turn, cou... » read more

Automotive Drives Novel IP Demands


In the past the automotive industry was a bit sleepy when it came to technologic innovations. Clearly, this is no longer the case. The automotive segment is now driving interesting capabilities and an unprecedented level of creativity by the IP and SoC engineering teams targeting this now-dynamic sector. Historically, electronics for automotive was very different from those aimed at consumer... » read more

Antennas Everywhere


A simple rule when it comes to electronics is that while digital circuits scale, antennas do not. That may not sound like a serious problem until you consider that as more devices get connected—cars, watches, industrial equipment—and they add more features that require interaction with the outside world, they need more antennas to make it all work. In the future, there literally will be... » read more

Package Modeling Needs For A Robust IC Power Integrity Sign-Off


Progress in IC technology has allowed chip designers to pack more functionality and continually make better use of silicon area. This trend, coupled with the need to maintain low power using techniques such as voltage islands and power and clock gating, has caused the power consumption to vary across the chip and over time. This has introduced considerable amount of transient current peaks in t... » read more

Rethinking The Cloud


Data center architectures have seen very few radical changes since the commercial introduction of the [getentity id="22306" comment="IBM"] System/360 mainframe in 1964. There have been incremental improvements in speed and throughput over the years, with a move to a client/server model in the 1990s, but from a high level this is still an environment where data is processed and stored centrally ... » read more

← Older posts Newer posts →