Chip Industry Week In Review

By The SE Staff - 03 Nov, 2023 - Comments: 0

By Susan Rambo, Gregory Haley, Jesse Allen, and Liz Allan President Biden issued an executive order on the “Safe, Secure, and Trustworthy Development and Use of Artificial Intelligence.” It says entities need to report large-scale computing clusters and the total computing power available, including “any model that was trained using a quantity of computing power greater than 1,026 inte... » read more

Chiplets: Deep Dive Into Designing, Manufacturing, And Testing

By The SE Staff - 07 Aug, 2023 - Comments: 0

Chiplets are a disruptive technology. They change the way chips are designed, manufactured, tested, packaged, as well as the underlying business relationships and fundamentals. But they also open the door to vast new opportunities for existing chipmakers and startups to create highly customized components and systems for specific use cases and market segments. This LEGO-like approach sounds ... » read more

Preparing For 5G Millimeter Wave And 6G

By Ed Sperling - 21 Jun, 2023 - Comments: 0

Cellular technology is about to take a giant leap forward, but the packaging, assembly, and testing of the chips used in 5G millimeter wave and the forthcoming 6G ecosystem will be significantly more complicated than anything used in the past. So far, most 5G devices are still working at sub-6 GHz frequencies. A massive rollout of mmWave technology over the next few years will significantly ... » read more

Smart Manufacturing Makes Gains In Chip Industry

By Anne Meixner - 15 Jun, 2023 - Comments: 0

Lights out manufacturing is gaining steam across the semiconductor industry, accelerating productivity, improving quality, and reducing costs and environment impact. These benefits are the result of years of strategic investments in technologies like machine-to-machine communication, data analytics, and robotics to achieve higher levels of autonomy. Semiconductor factories have long depen... » read more

Week In Review: Semiconductor Manufacturing, Test

By Gregory Haley - 09 Jun, 2023 - Comments: 0

The European Union’s Chips Act Commission has approved €8.1 billion ($8.73 billion) in funding for an Important Project of Common European Interest (IPCEI). As part of this IPCEI, 56 companies, including small and medium-sized enterprises (‘SMEs') and start-ups, will undertake 68 projects in research, innovation, and deployment of microelectronics and communication technologies across th... » read more

Chiplet Planning Kicks Into High Gear

By Ann Mutschler - 25 May, 2023 - Comments: 0

Chiplets are beginning to impact chip design, even though they are not yet mainstream and no commercial marketplace exists for this kind of hardened IP. There are ongoing discussions about silicon lifecycle management, the best way to characterize and connect these devices, and how to deal with such issues as uneven aging and thermal mismatch. In addition, a big effort is underway to improve... » read more

Challenges Grow For Creating Smaller Bumps For Flip Chips

By Anne Meixner - 18 May, 2023 - Comments: 0

New bump structures are being developed to enable higher interconnect densities in flip-chip packaging, but they are complex, expensive, and increasingly difficult to manufacture. For products with high pin counts, flip-chip [1] packages have long been a popular choice because they utilize the whole die area for interconnect. The technology has been in use since the 1970s, starting with IBM�... » read more

Smarter Ways To Manufacture Chips

By Anne Meixner - 20 Apr, 2023 - Comments: 0

OSAT and wafer fabs are beginning to invest in Industry 4.0 solutions in order to improve efficiency and reduce operating costs, but it's a complicated process that involves setting up frameworks to evaluate different options and goals. Semiconductor manufacturing facilities have relied on dedicated automation teams for decades. These teams track and schedule chip production, respond to equi... » read more

Mechanical Challenges Rise With Heterogeneous Integration

By Ed Sperling - 03 Apr, 2023 - Comments: 0

Companies integrating multiple chips or chiplets into a package will need to address structural and other mechanical engineering issues, but gaps in the design tools, new materials and interconnect technologies, and a shortage of expertise are making it difficult to address those issues. Throughout most of the history of the semiconductors, few people outside of foundries worried about struc... » read more

Power Semiconductors: A Deep Dive Into Materials, Manufacturing & Business

By The SE Staff - 03 Apr, 2023 - Comments: 0

Whether you’re the owner of the average smartphone, commuting on trains, or driving around in a Tesla, you use power semiconductor devices every day. In a technology-dependent world, these devices are everywhere, and demand for more types of chips using different materials is growing. In the past, most engineers paid little attention to power semiconductors. They were deemed commodity, off... » read more

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