Designer And IP Tracks Swell With Focus On ML, Security And Traditional EDA Methodologies


What are designers keenly interested in as the 57th Design Automation Conference (DAC) approaches? If you said machine learning (ML), you’d be only partially right. Based on designer and IP tracks submissions to the 57th edition of the venerable electronics-industry event, ML – how to design with it and optimize EDA tools and flows using it – is a hot topic. But so too are more traditi... » read more

An Eye For An AI


AI comes in multiple forms and flavors. The challenge is choosing the right one for the right purpose, and recognizing that just because AI can be applied to a particular process or problem doesn't mean it should be. While AI has been billed as a ideal solution for just about every problem, there are three primary requirements for a successful application. First, there needs to be sufficient q... » read more

RTL Architect: Simply Better RTL


Electronic devices play a key role in society. They connect us to one another through voice, video and chat. They entertain, educate, protect and heal us in new and ever-expanding ways. They have changed the way we work, live and play. Silicon chips are the fast beating heart (2 to 3 billion beats per second) of these devices. For decades, the relentless advancements in semiconductor process te... » read more

Test Is Becoming A Horizontal Process


Semiconductor test, once a discrete part of a well-orchestrated series of manufacturing steps, is looking more like a process that extends from the early concept stage in design to the end of life of whatever system that chip ultimately is used for. This has important ramifications for safety-critical markets in general, and the semiconductor industry in particular. Both worlds have been inc... » read more

Better, Not Best


The semiconductor industry has been lulled into a particular way of thinking by Moore's Law. It is like the age-old joke — you don't have to outrun a bear, you only have to be faster than your companion. The same has held true for designs. There is little to no point being the best, you only have to be good enough to be better than the competition. That sets the bar. Best is also relative.... » read more

Test Moving Forward And Backward


Test, once considered an important but rather mundane way of separating good chips from the not-so-good and the total rejects, is taking on a whole new life. After decades of largely living in the shadows behind design and advancements in materials and lithography, test has quietly shifted into a much more critical and more public role. But it has taken several rather significant shifts acro... » read more

When Verification Leads


Semiconductor Engineering sat down to discuss the implications of having an executable specification that drives verification with Hagai Arbel, CEO for VTool; Adnan Hamid, CEO for Breker Verification; Mark Olen, product marketing manager for Mentor, a Siemens Business; Jim Hogan, managing partner of Vista Ventures; Sharon Rosenberg, senior solutions architect for Cadence Design Systems; and Tom... » read more

Driving Change in the Age of Electric Vehicles


Manufacturers worldwide have accelerated the production of electric vehicles (EVs), ranging from cars to two-wheelers to buses. Between 2016 and 2017, sales of EVs grew by 54%. It is predicted that there will be up to 228 million EVs worldwide by 2030. Read about how engineering simulations will play a large role in this growth worldwide. Click here to read more. » read more

Concurrent Test


Derek Wu, senior staff applications engineer at Advantest, looks at the need for doing multiple tests at the same time as chip designs become more complex, increasingly heterogeneous, and much more difficult to test at advanced nodes. https://youtu.be/-8inbjX_af0       __________________________________ See more tech talk videos here. » read more

Design For Advanced Packaging


Advanced packaging techniques are viewed as either a replacement for Moore's Law scaling, or a way of augmenting it. But there is a big gap between the extensive work done to prove these devices can be manufactured with sufficient yield and the amount of attention being paid to the demands advanced packaging has on the design and verification flows. Not all advanced packaging places the same... » read more

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