Fab Tool Industry Has Lost Its Way


The relationship between chipmakers and fab tool vendors has always been a bit rocky, but the supply chain has generally worked. Chipmakers demand a tool for a particular application. Then, tool makers attempt to deliver the goods, and ask few, if any, questions. Now, fab tool executives are beginning to ask some tough questions about the industry. And the tension is mounting between equ... » read more

The Week In Review: Manufacturing And Design


Crucial.com reveals a surprising way to gain more time for improving one's personal health: fix a slow computer. A nationwide survey revealed that U.S. adults think they waste an average of 16 minutes per day waiting for their computer to load or boot up. Equating to two hours each week and four days per year lost to the wiles of a slow computer, it's no surprise that 66% of Americans say that ... » read more

Manufacturing Bits: Dec. 17


Implantable TFETs At the recent IEEE International Electron Devices Meeting (IEDM) in Washington, D.C., a number of companies, R&D organizations and universities described new breakthroughs in perhaps the next big thing in semiconductors--the tunnel field-effect transistor (TFET). Aimed for the 5nm node, TFETs are steep sub-threshold slope transistors that can scale the supply voltages bel... » read more

Leti Outlines FDSOI And Monolithic 3D IC Roadmaps


Semiconductor Engineering discussed the future roadmaps for fully depleted silicon-on-insulator (FDSOI) technology and monolithic 3D chips with Maud Vinet, manager for the Innovative Devices Laboratory at CEA-Leti. SE: What are some of the technologies being developed at the Innovative Devices Laboratory? Vinet: The Innovative Devices Laboratory is involved with advanced CMOS. So basically... » read more

What’s After 10nm?


For some time, chipmakers have roughly doubled the transistor count at each node, while simultaneously cutting the cost by around 29%. IC scaling, in turn, enables faster and lower cost chips, which ultimately translates into cheaper electronic products with more functions. Consumers have grown accustomed to the benefits of Moore’s Law, but the question is for how much longer? Chips based ... » read more

Momentum Builds For Monolithic 3D ICs


The 2.5D/3D chip market is heating up on several fronts. On one front, stacked-die using through-silicon vias (TSVs) is taking root. In a separate area, Samsung is sampling the world’s first 3D NAND device, with Micron and SK Hynix expected to follow suit. And now, there is another technology generating steam—monolithic 3D integrated circuits. In stacked-die, bare die are connected using... » read more

The Week In Review: Manufacturing & Design


Silver surfers represent a more important technology market than “Generation X” and “Generation Y,” according to research from Gartner. Silver surfers are people in middle age or approaching old age. Although most technologists fail to recognize this fact, they are very interested in using technology and also have the time and the resources to pursue their interests, according to Gartne... » read more

VLSI Kyoto – The SOI Papers


By Adele Hars There were some breakthrough FD-SOI and other excellent SOI-based papers that came out of the 2013 Symposia on VLSI Technology and Circuits in Kyoto (June 10-14, 2013). By way of explanation, VSLI comprises two symposia: one on Technology; one on Circuits. However, papers that are relevant to both were presented in “Jumbo Joint Focus” sessions.  The papers should all b... » read more

Newer posts →