tag: Rice University

Interconnects: Exploring Semi-Metals (Penn State, IBM, Rice University)
By Technical Paper Link - 26 Mar, 2023 - Comments: 0

A technical paper titled "Exploring Topological Semi-Metals for Interconnects" was published by researchers at Penn State, IBM, and Rice University, with funding by Semiconductor Research Corporation (SRC). Abstract "The size of transistors has drastically reduced over the years. Interconnects have likewise also been scaled down. Today, conventional copper (Cu)-based interconnects face a ... » read more

Chip Industry’s Technical Paper Roundup: Jan. 31
By Linda Christensen - 31 Jan, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library. [table id=77 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us posting l... » read more

3-Terminal Thermal Transistor With Thermal Measurements For The Switching And Amplification
By Technical Paper Link - 29 Jan, 2023 - Comments: 1

A technical paper titled "A three-terminal magnetic thermal transistor" was published my researchers at Rice University (Texas). Abstract "Three-terminal thermal analogies to electrical transistors have been proposed for use in thermal amplification, thermal switching, or thermal logic, but have not yet been demonstrated experimentally. Here, we design and fabricate a three-terminal magneti... » read more

Research Bits: Sept. 20
By Jesse Allen - 20 Sep, 2022 - Comments: 0

Multi-mode memristors Researchers from ETH Zurich, the University of Zurich, and Empa built a new memristor that can operate in multiple modes and could potentially be used to mimic neurons in more applications. “There are different operation modes for memristors, and it is advantageous to be able to use all these modes depending on an artificial neural network’s architecture,” said R... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 18 Mar, 2022 - Comments: 0

Chipmakers, OEMs Intel continues to build more fabs. First, the company announced fabs in Arizona and then Ohio. Now, Intel plans to invest up to €80 billion in the European Union over the next decade. As part of the effort, Intel plans to build two semiconductor fabs in Magdeburg, Germany. Construction is expected to begin in the first half of 2023 and production planned to come online in 2... » read more

Power/Performance Bits: Jan. 25
By Jesse Allen - 25 Jan, 2022 - Comments: 0

Nanoscale 3D optics Researchers at Rice University and University of Houston are using 3D printing to build nanostructures of silica for micro-scale electronic, mechanical, and photonic devices. “It’s very tough to make complicated, three-dimensional geometries with traditional photolithography techniques,” said Jun Lou, a professor of materials science and nanoengineering at Rice. �... » read more

Power/Performance Bits: April 5
By Jesse Allen - 05 Apr, 2021 - Comments: 0

Wafer-scale graphene In an attempt to make graphene more useful for photonic devices, researchers from CNIT, Istituto Italiano di Tecnologia (IIT), Tecip Institute, University of Cambridge, and Graphene Flagship Associated Member and spin-off CamGraphIC developed a wafer-scale graphene fabrication technology that uses predetermined graphene single-crystal templates, allowing for integration in... » read more

Power/Performance Bits: Aug. 25
By Jesse Allen - 25 Aug, 2020 - Comments: 0

AI architecture optimization Researchers at Rice University, Stanford University, University of California Santa Barbara, and Texas A&M University proposed two complementary methods for optimizing data-centric processing. The first, called TIMELY, is an architecture developed for “processing-in-memory” (PIM). A promising PIM platform is resistive random access memory, or ReRAM. Whil... » read more

Manufacturing Bits: May 5
By Mark LaPedus - 05 May, 2020 - Comments: 0

Spiking neural network radar chip Imec has developed what the R&D organization says is the world’s first chip that processes radar signals using a spiking recurrent neural network. Initially, the chip from Imec is designed for low-power, anti-collision radar systems in drones. Neural networks are used in the field of machine learning. A subset of AI, machine learning utilizes a neu... » read more

Power/Performance Bits: March 24
By Jesse Allen - 24 Mar, 2020 - Comments: 0

Backscatter Wi-Fi radio Engineers at the University of California San Diego developed an ultra-low power Wi-Fi radio they say could enable portable IoT devices. Using 5,000 times less power than standard Wi-Fi radios, the device consumes 28 microwatts while transmitting data at a rate of 2 megabits per second over a range of up to 21 meters. "You can connect your phone, your smart devices, ... » read more

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