Building The IoE
Reset Domain Crossing Verification
How to identify reset domain bugs due to soft resets in automotive designs.
May 13, 2024
Security Matters
Securing AI In The Data Center
High-value datasets containing sensitive information must be shielded from un...
May 9, 2024
Flexible Chips
Overcoming Chiplet Integration Challenges With Adaptability
The evolution of chiplets is realizing real-world integration problems that c...
May 9, 2024
OT-ICS Security
Enhancing HMI Security: How To Protect ICS Environments F...
GUIs and remote access can provide an entry point for bad actors.
May 9, 2024
Safe, Secure, Smarter Cars
Earning Digital Trust
Certification that root-of-trust IP is protected from physical attacks.
May 9, 2024
Design Bytes
UCIe And Automotive Electronics: Pioneering The Chiplet R...
Modular design for the increasing complexity and functionality of modern vehi...
May 9, 2024
At The Edge
General-Purpose 32-bit RISC-V MCU Core Expands Design Fre...
There is plenty of room under the MCU tent for competing and complementary pr...
May 9, 2024
Hardware Security
Why Semiconductor Security Is More Important Than Ever in...
Regulatory pressure and the emergence of complex cyberattacks make implementi...
April 4, 2024
Circuit Talk: Unpacked
Texas: Cybersecurity Workforce Resilience And eCTF Success
Encouraging computer science students to be interested in embedded cybersecur...
October 5, 2023
Memory Of Everything
Flash Memory Market Ushered In Fierce Competition With Th...
New opportunities for NOR flash as automotive electronics expand.
August 3, 2023
EDA Looks Beyond Chips
System design, large-scale simulations, and AI/ML could open multi-trillion-dollar markets for tools, methodologies, and services.
Chip Industry Week In Review
Samsung, Synopsys' GAA processors; UMC's 3D IC process; Si wafer shipments down; SiC wafer processing equipment up; women in CHIPS Act projects; imec startup fund; Infineon, ETAS auto security collab; quantum error correction; Intel's cryogenic probing process.
Is There Any Hope For Asynchronous Design?
This approach has long held promise, but never managed to deliver. Is there a fundamental problem, or is it just bad luck?
Chip Industry Week In Review
Domain-specific ICs; Arm's new AI chips; 50% tariffs on China ICs; Polar's CHIPS Act win; AI worker risks; Intel's Ireland fab; S.Korea's $7B chip package; auto AI chips and SDV partnerships; Advantest's system for high-current devices; scalable photonics; diamond wafers.
Multi-Die Design Pushes Complexity To The Max
Continued scaling using advanced packaging will require changes across the entire semiconductor ecosystem.