Low Power-High Performance

Top Stories

Will Domain-Specific ICs Become Ubiquitous?
How shifts in end markets and device scaling could alter some fundamental assumptions in chip design.
Published on May 16th, 2024 by Brian Bailey

Running More Efficient AI/ML Code With Neuromorphic Engines
Once a buzzword, neuromorphic engineering is gaining traction in the semiconductor industry.
Published on May 16th, 2024 by Karen Heyman

Power/Performance Costs In Chip Security
Implementing security measures isn't free. It affects everything from latency and battery life to the equipment and processes used to develop a chip.
Published on May 16th, 2024 by Adam Kovac

Design Considerations In Photonics
As photonics and CMOS converge, will design engineers feel comfortable outside of their respective specialties?
Published on May 1st, 2024 by Karen Heyman

Memory On Logic: The Good And Bad
Do the benefits outweigh the costs of using memory on logic as a stepping-stone toward 3D-ICs?
Published on April 11th, 2024 by Brian Bailey

Using AI/ML To Minimize IR Drop
Heterogeneous and advanced-node designs are creating unexpected post-layout challenges for design teams, but some issues can be addressed earlier i...
Published on April 11th, 2024 by Ann Mutschler

Linear Drive Optics May Reduce Data Latency
As data demands increase, the photonics industry tries new solutions.
Published on April 11th, 2024 by Karen Heyman

The Challenges Of Working With Photonics
From curvilinear designs to thermal vulnerabilities, what engineers need to know about the advantages and disadvantages of photonics.
Published on April 1st, 2024 by Karen Heyman

Optimizing Energy At The System Level
A lot of effort has gone into optimization of hardware during implementation, but that is a small fraction of the total opportunity.
Published on March 18th, 2024 by Brian Bailey

Backside Power Delivery Adds New Thermal Concerns
Lack of shielding, routing issues, and new mechanical stresses could have broad impact on standard cell design.
Published on March 14th, 2024 by Karen Heyman

More Top Stories »



Round Tables

Design Considerations In Photonics
As photonics and CMOS converge, will design engineers feel comfortable outside of their respective specialties?
Published on May 1st, 2024 by Karen Heyman

The Challenges Of Working With Photonics
From curvilinear designs to thermal vulnerabilities, what engineers need to know about the advantages and disadvantages of photonics.
Published on April 1st, 2024 by Karen Heyman

Photonics: The Former And Future Solution
Twenty-five years ago, photonics was supposed to be the future of high technology. Has that future finally arrived?
Published on March 14th, 2024 by Karen Heyman

Memory’s Future Hinges On Reliability
Robust implementations are a major issue, particularly as memory density increases.
Published on February 14th, 2024 by Karen Heyman

Rethinking Memory
Von Neumann architecture is here to stay, but AI novel architectures and 3D structures create a need for new testing tools.
Published on January 22nd, 2024 by Karen Heyman

More Roundtables »



Multimedia

Challenges With Chiplets And Power Delivery
Benefits and challenges in heterogeneous integration.
Published on April 15th, 2024 by Ed Sperling

New Issues In Power Semiconductors
Challenges increase with higher voltage and heterogeneous integration in advanced packages.
Published on February 26th, 2024 by Ed Sperling

Very Short Reach SerDes In Data Centers
Eliminating bottlenecks as the volume of data increases.
Published on December 13th, 2023 by Ed Sperling

Issues In Calculating Glitch Power
Which of the growing number of corners must be addressed?
Published on October 11th, 2023 by Ed Sperling

Changes In Memory Design
Customization, reliability, and much more data are altering how memory is developed and used.
Published on June 29th, 2023 by Ed Sperling

More Multimedia »



See All Posts in Low Power-High Performance »

Latest Blogs

Spotlight On Reliability

Efficient Electronics
Reducing energy consumption involves striking a balance between universal and...
May 16, 2024
by Andy Heinig
IP And LP In SoCs

How To Successfully Deploy GenAI On Edge Devices
Smaller models with fewer parameters put image generators and chatbots within...
May 16, 2024
by Gordon Cooper
A Bit About Memory

DDR5 PMICs Enable Smarter, Power-Efficient Memory Modules
Moving power management from the motherboard to the DIMM increases memory per...
May 16, 2024
by Tim Messegee
Everything Low Power

How Quickly Can You Take Your Idea To Chip Design?
Program enables students and hobbyists to get a design fabricated at a fracti...
May 16, 2024
by Kira Jones
Power Source

Enabling Multiscale Simulation
Converging paths to integrated computational material engineering.
May 16, 2024
by Adarsh Chaurasia
At The Core

MPAM-Style Cache Partitioning With ATP-Engine And gem5
Testing system designs that allow privileged software to partition caches, me...
May 16, 2024
by Hristo Belchev
Embedded ML Design

Fallback Fails Spectacularly
Shifting inference workloads from the NPU leads to more than just a little sl...
May 16, 2024
by Steve Roddy
Power Architect

TSMC Uncorks A16 With Super Power Rail
Reporter's Notebook: Aggressive roadmap ramps up competition at the leading e...
April 25, 2024
by Barry Pangrle
Best Of Both: LP & HP

How To Get Accurate Inductance Extraction For Superconduc...
New physical verification approaches are needed to ensure the performance and...
April 11, 2024
by Hossam Sarhan
MIPI And Beyond

MIPI In Next Generation Of AI IoT Devices At The Edge
IoT demands a balance between cloud and edge processing to optimize system pe...
April 11, 2024
by Ashraf Takla
Design Reuse Made Real

Quantum Computing: Top 5 Questions Answered
Quantum error detection, suppression, and correction strategies are critical ...
March 14, 2024
by Jenn Mullen

Knowledge Centers
Entities, people and technologies explored


  Trending Articles

Electromigration Concerns Grow In Advanced Packages
Higher density, heat, and more materials make it harder to ensure reliability.
by Laura Peters

What Works Best For Chiplets
Not all chiplets are interchangeable, and options will be limited.
by Anne Meixner

EDA Looks Beyond Chips
System design, large-scale simulations, and AI/ML could open multi-trillion-dollar markets for tools, methodologies, and services.
by Ed Sperling

Chip Industry Week In Review
Samsung, Synopsys' GAA processors; UMC's 3D IC process; Si wafer shipments down; SiC wafer processing equipment up; women in CHIPS Act projects; imec startup fund; Infineon, ETAS auto security collab; quantum error correction; Intel's cryogenic probing process.
by The SE Staff

Is There Any Hope For Asynchronous Design?
This approach has long held promise, but never managed to deliver. Is there a fundamental problem, or is it just bad luck?
by Brian Bailey

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