What Were They Thinking
Revitalizing DAC
It is great to see the DAC conference come back to life, but EDA companies ne...
April 25, 2024
A System Perspective
The 3D-IC Multiphysics Challenge Dictates A Shift-Left St...
Gleaning useful information well before all the details of an assembly are kn...
April 25, 2024
Making Formal Normal
Verification In Crisis
How can formal verification help?
April 25, 2024
Looking Past The Horizon
How To Get The Most Out Of Gate-All-Around Designs
Co-optimization of foundation IP and design flows for new transistors.
April 25, 2024
First By Design
How 6G Research Will Revolutionize Mobile Experiences
AI will be used in just about every subsystem of 6G networks.
April 25, 2024
Clock Talk
Staying Within The Margins
Why real-time values are essential for identifying future variations in volta...
March 28, 2024
Editor's Note
Which Processor Is Best?
Intel's support for RISC-V marks a technological and cultural shift.
March 1, 2022
EDA Looks Beyond Chips
System design, large-scale simulations, and AI/ML could open multi-trillion-dollar markets for tools, methodologies, and services.
Chip Industry Week In Review
Samsung, Synopsys' GAA processors; UMC's 3D IC process; Si wafer shipments down; SiC wafer processing equipment up; women in CHIPS Act projects; imec startup fund; Infineon, ETAS auto security collab; quantum error correction; Intel's cryogenic probing process.
Is There Any Hope For Asynchronous Design?
This approach has long held promise, but never managed to deliver. Is there a fundamental problem, or is it just bad luck?
Chip Industry Week In Review
Domain-specific ICs; Arm's new AI chips; 50% tariffs on China ICs; Polar's CHIPS Act win; AI worker risks; Intel's Ireland fab; S.Korea's $7B chip package; auto AI chips and SDV partnerships; Advantest's system for high-current devices; scalable photonics; diamond wafers.
Multi-Die Design Pushes Complexity To The Max
Continued scaling using advanced packaging will require changes across the entire semiconductor ecosystem.