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Higher density, heat, and more materials make it harder to ensure reliability.
Not all chiplets are interchangeable, and options will be limited.
System design, large-scale simulations, and AI/ML could open multi-trillion-dollar markets for tools, methodologies, and services.
Samsung, Synopsys’ GAA processors; UMC’s 3D IC process; Si wafer shipments down; SiC wafer processing equipment up; women in CHIPS Act projects; imec startup fund; Infineon, ETAS auto security collab; quantum error correction; Intel’s cryogenic probing process.
This approach has long held promise, but never managed to deliver. Is there a fundamental problem, or is it just bad luck?