Special Reports

EDA Looks Beyond Chips

By: Ed Sperling

System design, large-scale simulations, and AI/ML could open multi-trillion-dollar markets for tools, methodologies, and services.
Architecting Chips For High-Performance Computing

By: Ann Mutschler

Data center IC designs are evolving, based on workloads, but making the tradeoffs for those workloads is not always straightforward.
Digital Twins Target IC Tool And Fab Efficiency

By: Laura Peters

Virtual representations will improve performance and productivity across the entire design through manufacturing flow, but deployments will vary in effectiveness...

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Top Stories

Dealing With AI/ML Uncertainty

How neural network-based AI systems perform under the hood is currently unknown, but th...

Is There Any Hope For Asynchronous Design?

This approach has long held promise, but never managed to deliver. Is there a fundament...

Navigating The GPU Revolution

Potential cost and time benefits are driving GPU adoption, despite challenges.

Predicting And Preventing Process Drift

AI/ML are increasingly vital for good yield and reliability, but there are still plenty...

Electromigration Concerns Grow In Advanced Packages

Higher density, heat, and more materials make it harder to ensure reliability.

What Works Best For Chiplets

Not all chiplets are interchangeable, and options will be limited.

Enabling Advanced Devices With Atomic Layer Processes

Tradeoff between precision and speed becomes more critical at advanced nodes.

Future-Proofing Automotive V2X

Questions remain about how far out the industry can reasonably plan due to the pace of ...

Memory On Logic: The Good And Bad

Do the benefits outweigh the costs of using memory on logic as a stepping-stone toward ...

Using AI/ML To Minimize IR Drop

Heterogeneous and advanced-node designs are creating unexpected post-layout challenges ...

Linear Drive Optics May Reduce Data Latency

As data demands increase, the photonics industry tries new solutions.

IC Test And Quality Requirements Drive New Collaboration

Tight integration of test equipment, monitors, and analytics are beyond the scope of on...

more top stories »

Latest News

TSMC Uncorks A16 With Super Power Rail

Reporter's Notebook: Aggressive roadmap ramps up competition at the leading edge.

Blog Review: April 24

HBM for AI; IR drop; digital threads; design data management.

more news »



Research

Research Bits: April 23

Probabilistic computer prototype; photonic AI chiplet; observi...

Chip Industry Technical Paper Roundup: April 23

High-NA EUVL defect inspection; ML-based HW fuzzing; low conta...

Research Bits: April 16

Tunable thermal conductivity in memristors; amorphous oxide se...

more research »



Startup Corner

Startup Funding: March 2024

Investors connect with interconnects; $1.1 billion for 39 comp...

Startup Funding: February 2024

Power electronics, data center interconnects among 49 startups...

more startups »

Videos

Secure Movement Of Data In Test


Challenges With Chiplets And Power Delivery


Challenges In RISC-V Verification


Cache Coherency In Heterogeneous Systems


Knowledge Centers / Entities, people and technologies explored