Blog Review: April 24
HBM for AI; IR drop; digital threads; design data management.
Chip Industry Week In Review
TSMC-SK hynix HBM4 deal; Intel's high-NA EUV; big haul for Micron, Samsung; Cadence's new emulation, prototyping systems; architecting chips for HPC; Japan, China...
Research Bits: April 23
Probabilistic computer prototype; photonic AI chiplet; observi...
Chip Industry Technical Paper Roundup: April 23
High-NA EUVL defect inspection; ML-based HW fuzzing; low conta...
Research Bits: April 16
Tunable thermal conductivity in memristors; amorphous oxide se...
Startup Funding: March 2024
Investors connect with interconnects; $1.1 billion for 39 comp...
Startup Funding: February 2024
Power electronics, data center interconnects among 49 startups...