Chip Industry Week In Review
TSMC-SK hynix HBM4 deal; Intel's high-NA EUV; big haul for Micron, Samsung; Cadence's new emulation, prototyping systems; architecting chips for HPC; Japan, China...
Blog Review: April 17
Crystal oscillators; GDDR7; PCIe over fiber optics; IC design version control.
Research Bits: April 16
Tunable thermal conductivity in memristors; amorphous oxide se...
Chip Industry Technical Paper Roundup: April 8
Verification of memory consistency; mitigating IR drop; IBM's ...
Research Bits: April 8
Annealing processor; microwave signal generation; phase change...
Startup Funding: March 2024
Investors connect with interconnects; $1.1 billion for 39 comp...
Startup Funding: February 2024
Power electronics, data center interconnects among 49 startups...