Special Report
AR/VR Glasses Taking Shape With New Chips
Smart glasses with augmented reality functions look more natural than VR goggles, but today they are heavily reliant on a phone for compute and next-gen communication.
Top Stories
How Secure Are Analog Circuits?
Multi-die assemblies enable more analog content, but that adds new security vulnerabilities for which there is little available research.
Mobile Chip Challenges In The AI Era
Edge AI, GenAI, and next-gen communications are adding more workloads to phones that are already under pressure to deliver high performance and low power.
Security Risks Mount For Aerospace, Defense Applications
Supply chain vulnerabilities, hardware attacks, and communications hacks are rife. Autonomous technology poses extra threats.
Video
Conversing With Your Dishwasher
How on-device AI can improve interactions with machines.
Sponsor Blogs
Rambus’ Bart Stevens examines the benefits of tailoring security subsystems to unique application requirements, in Creating A Modular And Versatile State-of-the-Art Cryptographic Subsystem.
Infineon’s Fanni Vikor explores a secure and interoperable framework for electronic identification and trust services, in The Evolution Of eIDAS: Past, Present, And Future.
Synopsys’ Dana Neustadter shows how to keep vehicle data secure and tamper-proof even if physical access is gained, in Securing The Road Ahead: MACsec Compliant For Automotive Use.
Synaptics’ Todd Dust digs into context-aware computing, enabling ultra-low-power operation while maintaining high-performance AI capabilities, in Multimodal AI For IoT Devices Requires A New Class Of MCU.
Siemens’ Jake Wiltgen highlights a holistic approach for addressing both systematic and random failures in electronic systems, in Accelerated Assurance For Functional Safety.
Cadence’s Robert Schweiger explains why virtual prototyping enables earlier software validation, in Accelerating Chiplet-Based SoC Design For AI-Defined Vehicles.
Sponsor White Papers
A New RF Platform For Silicon MMIC And System Design
End-to-end solution that enhances EM analysis, improves co-design efficiency, and accelerates RF integration within heterogeneous systems.
A New Era Of Edge AI: E-Series GPU IP
The new generation of parallel processing solutions for fast, flexible and efficient on-device graphics and AI.
Next Level Inductive Sensing For New Metallic, Waterproof And Robust HMI Touch Designs
How inductive sensing (combined with capacitive sensing in some cases) enables a new level of smart surfaces with touch HMI.
The Hidden Cost Of Automotive Software Integration – A Shortcut That Changes Everything
Using horizontal integration with virtual electronic control units (vECUs), test automation, and continuous integration.
Newsletter Signup
Find our email newsletter signup page here.
