Special Reports

Backside Power Delivery Nears Production

By: Laura Peters

Breakthrough approach delivers better scaling and power efficiency, but at the cost of new processes like wafer thinning, bonding, and...
Advanced Packaging Fundamentals for Semiconductor Engineers

By: Bryon Moyer

New SE eBook examines the next phase of semiconductor design, testing, and manufacturing.
Auto Sector Leads The Way In IC Security

By: Ann Mutschler

Other markets include a hodgepodge of often ineffective approaches, but changes are coming as the value of connected assets increases.

 more »

Top Stories

AI Drives Re-Engineering Of Nearly Everything In Chips

Complexity, uncertainty, and lots of moving pieces will challenge the semiconductor ind...

New Ways To Improve EDA Productivity

A multi-faceted approach is required to deal with growing complexity and a shortage of ...

Analog Creates Ripples in Digital Verification

While analog and digital verification efforts have been essentially separated, closer i...

Need For Speed Drives Targeted Testing

Predictive modeling, strategic sampling and embedded monitors help accelerate testing f...

Secure Handling Of Financial Data In Manufacturing

Data sharing becomes more challenging when AI and multi-die assemblies are involved.

Can Chiplets Serve Cost-Conscious Apps?

The economics are not yet clear for industrial or consumer electronics.

Packaging With Fewer People And Better Results

Manufacturers are turning to automation, AI, and robotics to boost repeatability, cut c...

AI Agents Need Goals

AI cannot optimize unless it can measure progress towards goals, but defining those goa...

Chiplet Tradeoffs And Limitations

Multi-die assemblies offer more flexibility, but figuring out the right amount of custo...

Implementing AI Activation Functions

Why flexibility, area, and performance are traded off in AI inferencing designs.

3D-IC Ecosystem Starts To Take Form

Before any advancement can go mainstream, it requires an ecosystem. Chiplets are a firs...

Why Thin Film Measurements Matter

Controlling film thickness to precise specifications is essential for ensuring high yie...

more top stories »

Latest News

Chip Industry Week in Review

TSMC's technology roadmap; Intel cuts; reciprocal hacking; McKinsey on IC challenges, ML algorithm table; subsystem chiplets; cross-domain PLM; magnetic switches;...

Chip Industry Week In Review

TSMC, ASML earnings; 2nm processor; HBM4; touch controllers for foldable OLED displays; $500B AI supercomputer buildout; NVIDIA, AMD export licenses; Cadence's ac...

more news »



Opinion

Tape-Out Failures Are The Tip Of The Iceberg

As the success rate for the semiconductor industry declines, i...

An Inside Look At UPF 4.0

Why the Unified Power Format is necessary for verifying leadin...

more opinions »



Research

Chip Industry Technical Paper Roundup: Apr. 22

GenAI for analog; water immersion cooling; 2D materials roadma...

Research Bits: April 22

Photonic AI: Heterogeneous integration; nonlinear neural netwo...

Research Bits: Apr. 15

OLEDs: Shape-morphing panel with built-in speaker; bright stac...

more research »



Startup Corner

Startup Funding: Q1 2025

AI chips and data center communications see big funding; 75 st...

Startup Funding: Q4 2024

AI chips and interconnects end year on high note; $3 billion f...

more startups »

Videos

What’s Changing In SerDes


Optimizing Data Movement In SoCs And Advanced Packages


Changes In Motor Control


What’s Changing In Outlier Detection


Knowledge Centers / Entities, people and technologies explored