Special Reports

What’s The Best Way To Sell An Inference Engine?

By: Bryon Moyer

The hardware choices for AI inference engines are chips, chiplets, and IP. Multiple considerations must be weighed.
What’s Next For Through-Silicon Vias

By: Laura Peters

Fab tools are being fine-tuned for TSV processes as demand ramps for everything from HBM to integrated RF, power, and...
Navigating Increased Complexity In Advanced Packaging

By: Gregory Haley

Variability is a growing challenge; achieving higher yields requires even tighter control and precision.

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Top Stories

Power Budgets Optimized By Managing Glitch Power

While not a focus until now, earlier readings can be made in design to better understan...

2025: So Many Possibilities

This will be an incredible year for innovation, driven by AI and for AI, and pushing th...

AI Won’t Replace Subject Matter Experts

But it could help with mundane tasks, freeing up designers to focus on more intricate p...

Using Test And Metrology Data For Dynamic Process Control

Fine-tuning process control is imperative for advanced packaging, but ongoing challenge...

Screening For Known Good Interposers

Increasing interconnect density is making it harder to guarantee these devices will wor...

DFT At The Leading Edge

Rising complexity and heterogeneous integration are reshaping test methodologies and fa...

Startup Challenges In A Changing EDA World

Without innovation, it may not be possible to fully utilize technological advances.

Edge And IoT Security Turning A Corner

More attention, openness, and cross-market application of tools and techniques is start...

How Software-Defined Vehicles Change Auto Chip Design

SDVs are booming, but designing hardware that can run software updates a decade in the ...

ISO 26262’s Importance Widens Beyond Automotive

The international standard has been proven effective in automotive functional safety an...

Startup Funding: Q4 2024

AI chips and interconnects end year on high note; $3 billion for 75 companies.

Top Tech Videos Of 2024

What chip industry engineers watched in 2024.

more top stories »

Latest News

Chip Industry Week In Review

GF's new packaging and photonics center; flurry of regulation and fundings in U.S.; Chinese blacklist expands; materials report; new 3D interconnect process contr...

Blog Review: Jan. 15

Decoupling capacitor placement; AI agents; analog flow; PCIe protocol testing.

more news »



Opinion

Design And Verification Issues In 2024

What have you been reading over the past year? This often indi...

Goal-Driven AI

Any optimization problem must have a clear, unambiguous specif...

more opinions »



Research

Research Bits: Jan. 13

High-temp electrochemical memory; polymer data storage; magnet...

Research Bits: Jan. 7

Deep UV microLED for maskless lithography; avalanching nanopar...

Chip Industry Technical Paper Roundup: Jan. 7

Processing-in-DRAM; co-packaged optics; SOT-MRAM development; ...

more research »



Startup Corner

Startup Funding: Q3 2024

New startups emerge from stealth; 75 companies raise $2 billion.

Startup Funding: Q2 2024

Big rounds for AI chips; 91 startups raise $2.6 billion.

more startups »

Videos

Distributed Voltage And Frequency Scaling Gaining Traction


Speeding Up Acoustic Wafer Inspection


The Evolution of HBM


Using Formal For RISC-V Security


Knowledge Centers / Entities, people and technologies explored