Special Reports

Hybrid Bonding Makes Strides Toward Manufacturability

By: Laura Peters

Companies are selecting preferred flows, but the process details are changing rapidly to meet the needs of different applications.
Mass Customization For AI Inference

By: Ann Mutschler

The number of approaches to process AI inferencing is widening to deal with unique applications and larger and more complex...
Signals In The Noise: Tackling High-Frequency IC Test

By: Gregory Haley

Millimeter-wave frequencies require new test approaches and equipment; balancing precision with cost-efficiency is the challenge.

 more »

Top Stories

Big Changes Ahead For Analog Design

In-house flows are unable to keep up with foundry PDKs and heterogeneous integration, b...

EMEA Investments Driving Technology Specialization

Semiconductor policies, funding, and competitions are enabling industry and academia to...

Chiplets Make Progress Using Interconnects As Glue

Industry learning expands as more SoCs are disaggregated at leading edge, opening door ...

HW and SW Architecture Approaches For Running AI Models

Custom hardware tailored to specific models can unlock performance gains and energy sav...

RISC-V Conformance

Finding out if a processor implementation matches the specification is important, but c...

2D Semiconductors Make Progress, But So Does Silicon

Can 2D materials be fabricated consistently at a cost that competes with silicon?

Advanced Packaging Driving New Collaboration Across Supply Chain

Rising complexity is changing the way companies engage and interact, but long-standing ...

New Approaches To Power Decoupling

Strategic placement of decoupling capacitors and regulators is critical to keeping powe...

Monolithic Vs. Heterogeneous Integration

New processes, materials, and combinations of existing technologies will determine futu...

Americas Chip Funding Energizes Industry

Massive government infusions aim to improve security and supply chain robustness.

LLMs Show Promise In Secure IC Design

Large language models can identify and plug vulnerabilities, but they also may open new...

How Big A Deal Is Aging?

Aging must be understood, analyzed, and mastered. Until then, additional margins are th...

more top stories »

Latest News

Blog Review: Nov. 6

Deferrable memory write; MRAM & RRAM; 3D-IC multiphysics collaboration; aero & defense sensing; EDA basics.

Chip Industry Week In Review

Silicon Valley design center and NY EUV Accelerator; Siemens' big acquisition; Onto extends panel inspection with two acquisitions; DENSO-Quadric deal; thinner Si...

more news »



Opinion

Reactionary Or Anticipatory?

Is EDA meant to react to the needs of the industry, or anticip...

TSMC’s Plan For Closing The Communication Gap

COUPE For optical interconnect drives better performance and e...

Research

Chip Industry Technical Paper Roundup: Nov. 5

Multi-chiplet accelerators; photoresists for EUV; STT-MRAM; FP...

Research Bits: Nov. 5

Optical computing: In-memory processing; diffraction casting; ...

Chip Industry Technical Paper Roundup: Oct. 29

Chiplet-compatible RISC-V; HI for HPC; photonic in-memory comp...

more research »



Startup Corner

Startup Funding: Q3 2024

New startups emerge from stealth; 75 companies raise $2 billion.

Startup Funding: Q2 2024

Big rounds for AI chips; 91 startups raise $2.6 billion.

more startups »

Videos

Globally Asynchronous, Locally Synchronous Clocks


Big Changes In Optical Inspection


Working With Chiplets


Data Routing In Heterogeneous Chip Designs


Knowledge Centers / Entities, people and technologies explored