Special Reports

Mass Customization For AI Inference

By: Ann Mutschler

The number of approaches to process AI inferencing is widening to deal with unique applications and larger and more complex...
Signals In The Noise: Tackling High-Frequency IC Test

By: Gregory Haley

Millimeter-wave frequencies require new test approaches and equipment; balancing precision with cost-efficiency is the challenge.
Government Chip Funding Spreads Globally

By: Liz Allan

Nations vie for a piece of the semiconductor pie with offers of cash, subsidies, tax breaks, and other approaches.

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Top Stories

How Big A Deal Is Aging?

Aging must be understood, analyzed, and mastered. Until then, additional margins are th...

Unbundling Analog From Digital Where It Makes Sense

The shift toward heterogeneous integration and advanced packaging have changed the dyna...

Startup Funding: Q3 2024

New startups emerge from stealth; 75 companies raise $2 billion.

Metrology Advances Step Up To Sub-2nm Device Node Needs

Fab processes that enable stacked transistors, hybrid bonding, and advanced packaging a...

New Challenges In IC Reliability

How advanced packaging, denser circuits, and safety-critical markets are altering chip ...

Security Concerns Weigh Down Open-Source EDA

Issues vary by application and how and where it's used, but many tools already contain ...

Challenges In Reducing Wireless Latency

New protocols and technology will spur a whole new wave of chips, but those designs wil...

Managing Legacy In Automotive

As vehicle technology evolves, carmakers must decide which technologies move forward an...

The Cost Of EDA Data Storage And Processing Efficiency

Sustainability in the EDA process is less about the environment and more about preservi...

Preparing For Ferroelectric Devices

Managing crystal structure for ferroelectric performance.

Barriers To Chiplet Sockets

Perfection sometimes stands in the way of progress, and there is evidence this may be h...

Using AI To Glue Disparate IC Ecosystem Data

Why the chip industry is so focused on large language models for designing and manufact...

more top stories »

Latest News

Chip Industry Week In Review

Auto chiplet consortium; more nuke plants for AI; critical IC materials risk; TIMs; Foxconn in Mexico; ML in auto MCUs; 3nm PHY chiplet; chip health monitoring; A...

Blog Review: Oct. 9

ECAD-MCAD collaboration; AXI4 locking mechanism; SRAM PUF; ADAS challenges; gate resistance; Gemini AI’s network comms.

more news »



Research

Chip Industry Technical Paper Roundup: Oct. 14

High NA-EUV resolution; HKMG DRAM reliability; rethinking prog...

Research Bits: Oct. 14

Si-photonics chip emits beam of light; towards piezoelectric c...

Research Bits: Oct. 8

Materials: Soft, flexible polymer semiconductors; photonic top...

more research »



Startup Corner

Startup Funding: Q3 2024

New startups emerge from stealth; 75 companies raise $2 billion.

Startup Funding: Q2 2024

Big rounds for AI chips; 91 startups raise $2.6 billion.

more startups »

Videos

Big Changes In Optical Inspection


Working With Chiplets


Data Routing In Heterogeneous Chip Designs


Emerging Technologies Driving Heterogeneous Integration


Knowledge Centers / Entities, people and technologies explored