Special Reports

First-Time Silicon Success Plummets

By: Ed Sperling

Number of designs that are late increases. Rapidly rising complexity is the leading cause, but tools, training, and workflows need...
Big Changes Ahead For Interposers And Substrates

By: Gregory Haley

New materials and processes will help with power distribution and thermal dissipation in advanced packages.
The Rise Of Thin Wafer Processing

By: Laura Peters

From thinning and trimming to bonding and debonding, 3D package quality is built on precise and extremely thin wafer processes.

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Top Stories

Startup Funding: Q1 2025

AI chips and data center communications see big funding; 75 startups raise $2 billion.

Benefits And Challenges In Multi-Die Assemblies

What makes advanced packaging so attractive to some companies and not others.

Need For KGD Drives Singulated Die Screening

More and better screening of diced dies is essential to meet the quality and cost goals...

Challenges In Managing Chiplet Resources

The chip industry is exploring multiple avenues for simplifying multi-die integration, ...

Digital Twins For Design And Verification Workflows

Can we model the chip development flow so AI could optimize it?

The Evolving Role Of AI In Verification

Semiconductor verification is changing to integrate AI with human expertise.

What Exactly Are Chiplets And Heterogeneous Integration?

New technologies drive new terminology, but the early days for those new approaches can...

Many Options For EUV Photoresists, No Clear Winner

Chip industry searching for optimal balance of sensitivity, resolution, and LWR at lead...

Chip Failures: Prevention And Responses Over Time

How to identify the causes of failures before they happen, and how latent defects and r...

3D-IC For The Masses

Advanced assemblies have enabled an unprecedented rate of advancement in the data cente...

Chiplets Add New Power Issues

Well-understood challenges become much more complicated when SoCs are disaggregated.

Integrating Data From Design, Manufacturing, And The Field

Knowing where circuits came from, and the conditions in which they operate, can help de...

more top stories »

Latest News

Blog Review: Apr. 2

DisplayPort in automotive; collaboration barriers; nanobots; tight design margins.

Chip Industry Week In Review

U.S. IC chemicals and materials; China export blacklist expands; global fab equipment report; high-density 3D DRAM; optoelectronics advances; 2nm GAA deal; memory...

more news »



Opinion

Times Are Changing For EDA

The founders of EDA are retiring, and perhaps it's time that E...

GPU Or ASIC For LLM Scale-Up?

LLMs are just getting started.

more opinions »



Research

Research Bits: Apr. 1

Neuro-synaptic RAM; 3D photonic-electronic data link; complex ...

Chip Industry Technical Paper Roundup: Apr. 1

Nvidia GPUs; HW ANNs; optimizing GPU efficiency in LLMs; ONN w...

Research Bits: Mar. 25

2D materials in 3D transistors; electrochemical memristive mec...

more research »



Startup Corner

Startup Funding: Q1 2025

AI chips and data center communications see big funding; 75 st...

Startup Funding: Q4 2024

AI chips and interconnects end year on high note; $3 billion f...

more startups »

Videos

Optimizing Data Movement In SoCs And Advanced Packages


Changes In Motor Control


What’s Changing In Outlier Detection


Scenario Coverage In Formal Verification


Knowledge Centers / Entities, people and technologies explored