Special Reports

EDA’s Top Execs Map Out An AI-Driven Future

By: Ed Sperling

AI is accelerating the need for 3D-ICs and digital twins, and causing lots of disruption along the way.
The Best DRAMs For Artificial Intelligence

By: Bryon Moyer

The choice of DRAM depends on where the action is.
Rethinking Chip Reliability For Harsh Conditions

By: Gregory Haley

Shift right, then left is becoming more common for test and inspection in mission- and safety-critical applications.

 more »

Top Stories

Power Delivery Challenges For AI Chips

Rising power densities and new architectures are forcing a rethinking of interconnects,...

Physics Limits Interposer Line Lengths

Thin lines and limited ground planes keep RDL interconnects short.

Are Larger Reticle Sizes On The Horizon?

The stitching process for 1nm litho faces yield challenges with high-NA EUV.

Can You Build A Known-Good Multi-Die System?

Executive Outlook: Just because the various components in an advanced package work indi...

Photomask Changes And Challenges At Mature And Advanced Nodes

Evolving lithography demands are challenging mask writing technology, and the shift to ...

RISC-V’s Increasing Influence

Does the world need another CPU architecture when that no longer reflects the typical w...

Multi-Die Assemblies Complicate Parasitic Extraction

What used to be an afterthought is now a first-order concern for performance and power ...

Challenges In Using Sub-7nm ICs In Automotive

Targeted design for test, better fault models, and in-system testing must keep pace wit...

High-Quality Data Needed To Better Utilize Fab Data Streams

Engineers require timely and aligned data with just the right level of granularity.

How Secure Are Analog Circuits?

Multi-die assemblies enable more analog content, but that adds new security vulnerabili...

Mobile Chip Challenges In The AI Era

Edge AI, GenAI, and next-gen communications are adding more workloads to phones that ar...

Connecting AI Accelerators

How to put the pieces together in a complex design with AI is an unsolved problem.

more top stories »

Latest News

Chip Industry Week in Review

$60B fab buildout; Chinese automakers tout 100% homemade chips; 2nm custom SRAM; Cadence's virtual platform buy; multi-chiplet NoC; HBM roadmap; MIT's GaN fab tec...

Blog Review: June 18

HBM compatibility vs. customizability; 3D-IC marks shift for EDA; AI ToF decoding; AI-defined vehicles; genAI in EDA.

more news »



Opinion

TSMC: King Of Data Center AI

Opinion: The foundry makes all of the logic chips critical for...

The DAC Valuation

How much value does DAC really add to the industry? Large EDA ...

more opinions »



Research

Research Bits: June 24

Image sensors: In-sensor visual processing; better colors with...

Chip Industry Technical Paper Roundup: June 24

Wafer-scale AI accelerators vs. single chip GPUs; machine inte...

Chip Industry Technical Paper Roundup: June 17

HBM roadmap from KAIST; RISC-V base station-on-chip; fully aut...

more research »



Startup Corner

Baya Systems: Moving Data Faster

Taking aim at AI bottlenecks based on NoC technology developed...

Startup Funding: Q1 2025

AI chips and data center communications see big funding; 75 st...

more startups »

Videos

LLMs On The Edge


Agentic AI In Chip Design


Big Changes In Medical Electronics


Optical Interconnectivity At 224 Gbps


Knowledge Centers / Entities, people and technologies explored