Chip Industry Week in Review
$60B fab buildout; Chinese automakers tout 100% homemade chips; 2nm custom SRAM; Cadence's virtual platform buy; multi-chiplet NoC; HBM roadmap; MIT's GaN fab tec...
Blog Review: June 18
HBM compatibility vs. customizability; 3D-IC marks shift for EDA; AI ToF decoding; AI-defined vehicles; genAI in EDA.
TSMC: King Of Data Center AI
Opinion: The foundry makes all of the logic chips critical for...
The DAC Valuation
How much value does DAC really add to the industry? Large EDA ...
Research Bits: June 24
Image sensors: In-sensor visual processing; better colors with...
Chip Industry Technical Paper Roundup: June 24
Wafer-scale AI accelerators vs. single chip GPUs; machine inte...
Chip Industry Technical Paper Roundup: June 17
HBM roadmap from KAIST; RISC-V base station-on-chip; fully aut...
Baya Systems: Moving Data Faster
Taking aim at AI bottlenecks based on NoC technology developed...
Startup Funding: Q1 2025
AI chips and data center communications see big funding; 75 st...