Test, Measurement & Analytics

Top Stories

Advanced Packaging Makes Testing More Complex

Why 2.5D, 3D, and other advanced packaging types are driving new standards and approaches to testing.

Monitoring IC Abnormalities Before Failures

Deep and widespread dedicated circuitry for monitoring internal states supports deeper analytic insights for engineers

Data Becomes Key For Next-Gen Chips

Understanding how to utilize data from multiple sources is major challenge and opportunity for chipmakers.

Making Silicon Photonics Chips More Reliable

More data and new applications are making this technology increasingly attractive, but it's still not mainstream.

Using Fab Sensors To Reduce Auto Defects

Fab sensing technology coupled with analytics provides a path to improve reliability of autos.

Challenges In Making Better Medical Sensors

COVID-19 has opened the door to more widespread health monitoring, but sensors are getting more complex and testing isn't always easy.

BiST Vs. In-Circuit Sensors

Hybrid solutions emerging as reliability concerns increase and coverage becomes more difficult.

New Uses For Manufacturing Data

Consistency, completeness and sharing of data can provide insights about a chip's design, health and interactions, but it's not that simple.

Sensing Automotive IC Failures

Improving reliability and yield will require new ways to identify defects in chips.

An Inside Look At Testing’s Leading Edge

FormFactor's CEO peels back the covers on AI, 5G and HBM test issues.

More Top Stories »



Round Tables

New 5G Hurdles

Experts at the Table, part 2: Getting 5G standards and technology ready are only part of the problem. Reducing latency and developing applications ...

Preparing For A 5G World

Experts at the table, part 1: Rising costs, massive complexity, and challenges in testing and simulating these devices will require some fundamenta...

More Roundtables »



Multimedia

Using ML In Manufacturing

Applying machine learning to different use cases to limit early life failures.

Ensuring HBM Reliability

What can go wrong and how to find it.

Cleaning Data For Final Test

How the quality of data can affect time to yield.

Using Big Data For Yield And Reliability

What else is required to ensure chips will work as expected.

Scan Diagnosis

What causes expected values in a scan test to change?

More Multimedia »



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Latest Blogs

Scaling Electronics

No Two Chips Are Alike

Offsetting chip variability with deep data analytics
July 27, 2020
Editor's Note

Next Challenge: Known Good Systems

Test is turning into a continuous process rather than a discrete step as chip...
July 7, 2020
Test Insight From Lab To Fab

Probing From Home

How to remotely manage your probe station in the work-from-home era.
Semiconductor Yield Management

Adopting Yield Analysis Tools

A chat with Shane Zhang of DisplayLink on how the company uses yield analysis...
Inspecting The Future

Measuring Reflective Surfaces

High reliability requires measurements in multiple directions.
June 15, 2020
Yield Management

MRAM Process Development And Production Briefing

What is MRAM and why is it becoming more attractive to the industry?
March 10, 2020
Test For The Autonomous Age

Improving Functional Safety For ICs

An improvement to BIST to meet test coverage for ISO 26262.
Inside Big Data

Manufacturing Optimization With Digital Thread

By using a communication framework that tracks an asset's data throughout its...

Knowledge Centers
Entities, people and technologies explored


  Trending Articles

Manufacturing Bits: July 21

Intel’s next-gen MRAM; silicon oxide ReRAM; FeFETs.

RISC-V Gaining Traction

Experts at the Table: Extensible instruction-set architecture is drawing attention from across the industry and supply chain.

Startup Funding: June 2020

Sixteen startups draw $661M in June; big funding for chips in China; more quantum startups.

Universal Verification Methodology Running Out Of Steam

It’s time to move up in abstraction again as a complexity overwhelms a key approach.

The Race To Much More Advanced Packaging

Hybrid bonding opens up a big improvement in die-to-die performance, but getting there is not trivial.