Test, Measurement & Analytics

Top Stories

Racing To The Edge

The opportunity is daunting, but so are the challenges for making all the pieces work together.

New Approaches To Security

Data analytics, traffic patterns and restrictive policies emerge as ways to ensure that systems are secure.

3D NAND Metrology Challenges Growing

Rising costs and gaps in equipment emerge as technology scales; new tools under development.

Gaps In 5G Test

Millimeter wave technology will require a whole new approach to ensuring reliability.

Finding Defects In Chips With Machine Learning

Better algorithms and more data could bolster adoption, particularly at advanced nodes.

Domain Expertise Becoming Essential For Analytics

More data doesn't mean much unless you know what to do with it.

Using Sensor Data To Improve Yield And Uptime

Deeper understanding of equipment behavior and market needs will have broad impact across the semiconductor supply chain.

Mapping The Impact Of Heat On Photonics

Thermal effects are difficult to quantify, but they can disrupt optical signals and reduce the lifespan of lasers.

Reliability Becomes The Top Concern In Automotive

Extended lifetimes and advanced-node designs are driving new approaches, but not everything is going smoothly.

Chasing Reliability In Automotive Electronics

Supply chain changes, resistance to sharing data and technology unknowns add up to continued uncertainty.

More Top Stories »



Round Tables

New 5G Hurdles

Experts at the Table, part 2: Getting 5G standards and technology ready are only part of the problem. Reducing latency and developing applications ...

Preparing For A 5G World

Experts at the table, part 1: Rising costs, massive complexity, and challenges in testing and simulating these devices will require some fundamenta...

More Roundtables »



Multimedia

AI In Chip Manufacturing

How AI with knowledge transfer can significantly decrease error rates and improve test.

Concurrent Test

The growing challenge to do more in the same time window.

Planarization Challenges At 7nm And Beyond

Why it's becoming harder to prepare a wafer at advanced nodes.

ATE Lab To Fab

How to close the gap between the design and test worlds to improve coverage and shorten time to market.

Using DSA With EUV

Why directed self-assembly still has an important role to play at the most advanced nodes.

More Multimedia »



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Latest Blogs

Editor's Note

Preparing For War On The Edge

The tech world is planning for an onslaught of data, but it's far from clear ...
April 9, 2019
Test For The Autonomous Age

How To Manage DFT For AI Chips

AI-specific processors call for design-for-test techniques that boost time-to...
The Human Machine Interface

How Do I Know? A Machine Told Me So

Emerging machine learning techniques are pushing the boundaries of what compu...
Extraordinary ASICs

Chips That See

How to build an artificial eye for less than $2.
March 12, 2019
Accelerating Design & Test

MIMO And Phased-Array Antennas For 5G

Combine circuit and electromagnetic simulations for antennas with multiple fe...
Inside Big Data

The 3 Main Obstacles To Zero DPPM And How To Overcome Them

Reducing the rate of defective parts calls for a whole new quality paradigm.

Knowledge Centers
Entities, people and technologies explored


  Trending Articles

Making Chip Packaging Simpler

The promise of advanced packaging is being able to integrate heterogeneous chips, but a lot of work is needed to make that happen.

EUV Arrives, But More Issues Ahead

Improvement still needed for uptime, defectivity, line edge roughness and process flows.

Single Vs. Multi-Patterning EUV

Why this choice isn’t as obvious as it might look.

The 7nm Pileup

Why are so many companies rushing to do 7nm designs?

3D NAND Metrology Challenges Growing

Rising costs and gaps in equipment emerge as technology scales; new tools under development.