Delivering On Power During HPC Test
1 volt is not the problem. It's the 1,000+ amps.
Digital Twins Find Their Footing In IC Manufacturing
Technology will speed time to yield and add efficiency, but standards are needed for it to live up to its potential.
X-ray Inspection Becoming Essential In Advanced Packaging
Improvements in speed and precision have transformed a research tool for studying defects in chips into an industry workhorse.
What’s Missing In Test
Different types of test all work, but catching every real and potential issue remains a challenge.
Power-Aware Revolution In Automated Test For ICs
New approaches can improve yield and reliability, but they add more complexity into the test process.
Speeding Up Metrology At Advanced Nodes
Demand for higher reliability requires more advanced and historically slow equipment and methodologies, but improvements are on the way.
3D Metrology Meets Its Match In 3D Chips And Packages
Next-generation tools take on precision challenges in three dimensions.
Using Predictive Maintenance To Boost IC Manufacturing Ef...
Smarter tools enable smarter fabs but the logistics of predictive maintenance challenge implementation.
The Future Of Fault Coverage In Chips
System-level test offers speed and lower cost, but there are limits to what it can do.
Doing More At Functional Test
New approaches for cutting costs and improving reliability for increasingly complex chips.
What’s Missing In Test
Different types of test all work, but catching every real and potential issue remains a challenge.
Doing More At Functional Test
New approaches for cutting costs and improving reliability for increasingly complex chips.
Inspection, Metrology Issues In Advanced Packages
How to ensure that chips and chiplets will work as expected inside a package.
Applying ML In Failure Analysis
When and where machine learning is best used, and how to choose the right model.
Isolating Critical Data In Failure Analysis
Why a shortage of data often impedes root-cause analysis.
Making Adaptive Test Work Better
How to manage more data efficiently during test.
Overlay Optimization In Advanced IC Substrates
How analytics can improve yield in high-volume manufacturing of panels.
Cost And Quality Of Chiplets
Why adaptive test is becoming necessary in heterogeneous designs.
Yield Tracking In RDL
How to identify defects in panel-level packages, and why that's needed for generative AI in data centers.
Reducing Power In Data Centers
New approaches to improving utilization while reducing guard-banding.
