Promises and Perils of Parallel Test
Test costs may be reduced, but how much depends on a whole bunch of factors.
Standardizing Defect Coverage In Analog/Mixed Signal Test
IEEE P2427 is poised to be the cornerstone in the testing and validation of AMS designs; full industry support is still developing.
AI/ML’s Role In Design And Test Expands
But it's not always clear where it works best or how it will impact design-to-test time.
Metrology And Inspection For The Chiplet Era
Recent developments address imminent needs of advanced nodes and packages, but not all the pieces are in place yet.
Driving Cost Lower and Power Higher With GaN
Best practices continue to develop alongside an increased adoption of gallium nitride power devices.
Delivering On Power During HPC Test
1 volt is not the problem. It's the 1,000+ amps.
Digital Twins Find Their Footing In IC Manufacturing
Technology will speed time to yield and add efficiency, but standards are needed for it to live up to its potential.
X-ray Inspection Becoming Essential In Advanced Packaging
Improvements in speed and precision have transformed a research tool for studying defects in chips into an industry workhorse.
What’s Missing In Test
Different types of test all work, but catching every real and potential issue remains a challenge.
Power-Aware Revolution In Automated Test For ICs
New approaches can improve yield and reliability, but they add more complexity into the test process.
What’s Missing In Test
Different types of test all work, but catching every real and potential issue remains a challenge.
Doing More At Functional Test
New approaches for cutting costs and improving reliability for increasingly complex chips.
Inspection, Metrology Issues In Advanced Packages
How to ensure that chips and chiplets will work as expected inside a package.
Applying ML In Failure Analysis
When and where machine learning is best used, and how to choose the right model.
Isolating Critical Data In Failure Analysis
Why a shortage of data often impedes root-cause analysis.
Real-Time Safety Monitoring
How do you know when a safety-critical chip is working properly?
Making Adaptive Test Work Better
How to manage more data efficiently during test.
Overlay Optimization In Advanced IC Substrates
How analytics can improve yield in high-volume manufacturing of panels.
Cost And Quality Of Chiplets
Why adaptive test is becoming necessary in heterogeneous designs.
Yield Tracking In RDL
How to identify defects in panel-level packages, and why that's needed for generative AI in data centers.
