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Test, Measurement & Analytics

Top Stories

AI In Inspection, Metrology, And Test

AI systems are making inroads into IC manufacturing and assembly, but it's slow going — on purpose.

Sharing Secure Chip Data For Analytics

Security practices are evolving to meet sharing data across siloed engineering teams, but they still have a long way to go.

Monitoring Chips On Many Levels

Understanding chip behavior, performance, and aging from the inside.

Hunting For Open Defects In Advanced Packages

No single screening method will show all the possible defects that create opens.

Preventing Chips From Burning Up During Test

Scaling, packaging and a greater push for reliability add new challenges for testing chips.

Cloud Vs. On-Premise Analytics

Not all data analytics will move to the cloud, but the very thought of it represents a radical change.

Making Sure AI/ML Works In Test Systems

AI holds promise for improving reliability, but it's not perfect yet.

Predicting And Avoiding Failures In Automotive Chips

Experts at the Table: New approaches rely on more and better data, but it also requires sharing of data across the supply chain.

Part Average Tests For Auto ICs Not Good Enough

Advanced node chips and packages require additional inspection, analysis and time, all of which adds cost.

Automotive Test Moves In-System

Ensuring safety-critical systems continue to function is complex but necessary.

More Top Stories »



Round Tables

Predicting And Avoiding Failures In Automotive Chips

Experts at the Table: New approaches rely on more and better data, but it also requires sharing of data across the supply chain.

Chips Good Enough To Bet Your Life On

Experts at the Table: Strategies for improving automotive semiconductors.

Dealing With Two Very Different Sides Of 5G

Experts at the Table: One side is well-behaved and predictable, the other is not. How to ensure reliability across both is a looming challenge.

New 5G Hurdles

Experts at the Table, part 2: Getting 5G standards and technology ready are only part of the problem. Reducing latency and developing applications ...

Preparing For A 5G World

Experts at the table, part 1: Rising costs, massive complexity, and challenges in testing and simulating these devices will require some fundamenta...

More Roundtables »



Multimedia

Silicon Lifecycle Management

Mapping, tracking and reacting to changes throughout a chip’s expected lifetime.

Using ML In Manufacturing

Applying machine learning to different use cases to limit early life failures.

Ensuring HBM Reliability

What can go wrong and how to find it.

Cleaning Data For Final Test

How the quality of data can affect time to yield.

Using Big Data For Yield And Reliability

What else is required to ensure chips will work as expected.

More Multimedia »



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Latest Blogs

Intelligent Innovation

How Do Machines Learn?

How neural networks perform defect classification and many other tasks.
April 6, 2021
Silicon Lifecycle Management

Security For Cars That Are Smartphones On Wheels

The effort to establish automotive cybersecurity standards and best practices.
The Human Machine Interface

ATE In The Age Of Convergence And Exascale Computing

Keeping up with the test requirements of a new generation of devices.
Editor's Note

The Other Side Of AI System Reliability

Who wins and loses as more intelligence is added into devices.
March 9, 2021
Test Insight From Lab To Fab

Testing VCSEL Devices On-Wafer

Testing a key technology for 3D sensing capabilities in smartphones and autom...
February 9, 2021
Health & Performance Monitoring

Early And Fine Virtual Binning

Meeting market demand with higher precision at lower costs.
September 8, 2020
Inspecting The Future

Measuring Reflective Surfaces

High reliability requires measurements in multiple directions.
June 15, 2020
Yield Management

MRAM Process Development And Production Briefing

What is MRAM and why is it becoming more attractive to the industry?
March 10, 2020

Knowledge Centers
Entities, people and technologies explored


  Trending Articles

The Future Of Transistors And IC Architectures

The more compute power, the better. But what’s the best way to get there?

EUV Pellicles Finally Ready

Yield rises with mask protection; multiple sources will likely reduce costs.

What Goes Wrong In Advanced Packages

More heterogeneous designs and packaging options add challenges across the supply chain, from design to manufacturing and into the field.

Chasing After Carbon Nanotube FETs

CNTs promise big performance improvements, but achieving consistency and replacing incumbent technologies will be difficult.

Computing Where Data Resides

Computational storage approaches push power and latency tradeoffs.