Packaging, Test & Materials

Top Stories

Mapping The Impact Of Heat On Photonics

Thermal effects are difficult to quantify, but they can disrupt optical signals and reduce the lifespan of lasers.

Lithography Challenges For Fan-out

Advanced packaging moves into high-volume mobile markets, but requires more sophisticated equipment and lower-cost processes.

Reliability Becomes The Top Concern In Automotive

Extended lifetimes and advanced-node designs are driving new approaches, but not everything is going smoothly.

More 2.5D/3D, Fan-Out Packages Ahead

Progress on 3D-ICs, using HBM with fan-outs, and other new approaches.

The Next Semiconductor Revolution

Four industry experts talk about what's changing, how quickly, and where the limits are with AI.

Reducing Advanced Packaging Costs

Experts at the Table, Part 2: What's needed to make different packaging approaches more affordable, and why that may not be a critical factor in th...

Quantum Issues And Progress

Work begins on building a quantum computing ecosystem.

Packaging Biz Faces Challenges in 2019

Although IC packaging industry braces for slower growth in 2019, advanced packaging remains a bright spot.

The Growing Promise Of Printed Electronics

New sensors could vastly extend the reach of electronics, creating new markets and new opportunities within existing markets.

Panel Fan-out Ramps, Challenges Remain

Cost and the lack of a panel-size standard gives fan-out a slower start.

More Top Stories »

Round Tables

Reducing Advanced Packaging Costs

Experts at the Table, Part 2: What's needed to make different packaging approaches more affordable, and why that may not be a critical factor in th...

Where Advanced Packaging Makes Sense

Experts at the Table, Part 1: Impact on the supply chain, who's using advanced packaging, and the cost of packaging versus device scaling.

Sorting Out Packaging Options

Experts at the Table, Part 1: Better naming conventions will reduce confusion over different packaging types, while cost, applications and standard...

New 5G Hurdles

Experts at the Table, part 2: Getting 5G standards and technology ready are only part of the problem. Reducing latency and developing applications ...

Preparing For A 5G World

Experts at the table, part 1: Rising costs, massive complexity, and challenges in testing and simulating these devices will require some fundamenta...

More Roundtables »


AI In Chip Manufacturing

How AI with knowledge transfer can significantly decrease error rates and improve test.

Concurrent Test

The growing challenge to do more in the same time window.

Planarization Challenges At 7nm And Beyond

Why it's becoming harder to prepare a wafer at advanced nodes.

The Case For Chiplets

Issues in advanced packaging.

ATE Lab To Fab

How to close the gap between the design and test worlds to improve coverage and shorten time to market.

More Multimedia »

See All Posts in Packaging and Test »

Latest Blogs

The Human Machine Interface

Anticipating And Addressing 5G Testing Challenges

What's needed to measure device performance and reliability in next-gen wirel...
February 13, 2019
Inside Big Data

Using Data Analytics More Effectively

How to Extend Test Data Analytics Capabilities And Capacity
Editor's Note

The Paradox Of Automotive Electronics

Automakers are right in demanding quality, but wrong in their approach.
February 12, 2019
Riding The Silicon Rapids

What’s For Dinner?

Next frontier for robots—the kitchen.
Accelerating Design & Test

Antenna Array Design for ADAS

Creating automotive radar applications for mmWave needs special tools.
Material Science

What AI Is… And Isn’t

To make the best use of AI, understand its limitations.
January 15, 2019
Chiplet Connection

Virtual Packages Improve Signal Integrity

How to optimize chiplet architectures, including reducing in-package loss and...
October 23, 2018

Knowledge Centers
Entities, people and technologies explored

  Trending Articles

China’s Foundry Biz Takes Big Leap Forward

30 facilities planned, including 10/7nm processes, but trade war and economic factors could slow progress.

Mostly Upbeat Outlook For Chips

2019 will be a year of change for the semiconductor industry as new fields drive technological advancements.

What’s Next For AI, Quantum Chips

Leaders of three R&D organizations, Imec, Leti and SRC, discuss the latest chip trends in AI, packaging and quantum computing.

Unsticking Moore’s Law

Applied Materials’ VP looks at what’s next for semiconductor manufacturing and the impact of variation, new materials and different architectures.

Embedded Phase-Change Memory Emerges

What could make this memory type stand out from the next-gen memory crowd.