Packaging, Test & Materials

Top Stories

Packaging Biz Faces Challenges in 2019

Although IC packaging industry braces for slower growth in 2019, advanced packaging remains a bright spot.

The Growing Promise Of Printed Electronics

New sensors could vastly extend the reach of electronics, creating new markets and new opportunities within existing markets.

Where Advanced Packaging Makes Sense

Experts at the Table, Part 1: Impact on the supply chain, who's using advanced packaging, and the cost of packaging versus device scaling.

Panel Fan-out Ramps, Challenges Remain

Cost and the lack of a panel-size standard gives fan-out a slower start.

Testing Millimeter Wave for 5G

Stumbling blocks emerge for ensuring reliability of next-gen wireless devices.

The Big Data Shift Has Started

Brewer Science's CEO looks at what's changing across the industry, how long those shifts will last, and who will benefit from them.

Defect Challenges Growing In Advanced Packaging

Spotting defects with existing inspection tools is getting harder, but upgrading to new technology is expensive.

Lab-To-Fab Testing

Test vendors are trying to build a bridge between verification and automated test in manufacturing.

Automakers Take On More Responsibility

Carmakers shake up supply chain with their own test and system-level integration strategies.

Auto Chip Design, Test Changes Ahead

Which tools and methodologies will work best to ensure electronics operate for extended periods of time under harsh conditions?

More Top Stories »



Round Tables

Where Advanced Packaging Makes Sense

Experts at the Table, Part 1: Impact on the supply chain, who's using advanced packaging, and the cost of packaging versus device scaling.

Sorting Out Packaging Options

Experts at the Table, Part 1: Better naming conventions will reduce confusion over different packaging types, while cost, applications and standard...

New 5G Hurdles

Experts at the Table, part 2: Getting 5G standards and technology ready are only part of the problem. Reducing latency and developing applications ...

Preparing For A 5G World

Experts at the table, part 1: Rising costs, massive complexity, and challenges in testing and simulating these devices will require some fundamenta...

2.5D Surprises And Alternatives

Cost and supply chain issues remain as advanced packaging begins to ramp.

More Roundtables »



Multimedia

Concurrent Test

The growing challenge to do more in the same time window.

Planarization Challenges At 7nm And Beyond

Why it's becoming harder to prepare a wafer at advanced nodes.

The Case For Chiplets

Issues in advanced packaging.

ATE Lab To Fab

How to close the gap between the design and test worlds to improve coverage and shorten time to market.

Using DSA With EUV

Why directed self-assembly still has an important role to play at the most advanced nodes.

More Multimedia »



See All Posts in Packaging and Test »

Latest Blogs

Editor's Note

4 Issues In Test

This normally quiet segment is boiling over with challenges.
December 10, 2018
The Human Machine Interface

Food for Thought

The good and bad of using technology to modify what we eat.
Chiplet Connection

Virtual Packages Improve Signal Integrity

How to optimize chiplet architectures, including reducing in-package loss and...
October 23, 2018
Riding The Silicon Rapids

Collaboration And Advanced Substrates

Many companies have requirements that don't fit neatly into the CMOS roadmap.
October 8, 2018
Material Science

Solving Fan-Out Wafer-Level Warpage Challenges Using Mate...

Improving technologies that enable heterogeneous integration.
September 10, 2018
Accelerating Design & Test

Toward Project-Based Learning

The value of student-centered instruction over an extended period of time.
May 7, 2018

Knowledge Centers
Entities, people and technologies explored


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Where Advanced Packaging Makes Sense

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