Why Chips Fail, And What To Do About It
Improving reliability in semiconductors is critical for automotive, data centers, and AI systems.
Aftermarket Sensors Boost Yield In Wafer Fabs
More data improves throughput, helps extend the life of equipment.
Silicon Lifecycle Management Gains Steam
Gaps remain, but the broad integration of data from design through manufacturing, test, and assembly holds promise for improving reliability.
Testing For Thermal Issues Becomes More Difficult
Chiplets, exotic materials, and heterogeneous integration are impacting test coverage.
Advanced Packaging Drives Test And Metrology Innovations
Complex devices are pushing test and metrology tools to their limits, but solutions are coming online.
Yield Management Embraces Expanding Role
From wafer maps to lifecycle management, yield strategies go wide and deep with big data.
Balancing Parallel Test Productivity With Yield & Cost
Expensive DUT interface boards complicate development and operations.
Metrology Advances Step Up To Sub-2nm Device Node Needs
Fab processes that enable stacked transistors, hybrid bonding, and advanced packaging are driving the need for more and better measurements.
New Challenges In IC Reliability
How advanced packaging, denser circuits, and safety-critical markets are altering chip and system design.
Signals In The Noise: Tackling High-Frequency IC Test
Millimeter-wave frequencies require new test approaches and equipment; balancing precision with cost-efficiency is the challenge.
Why Chips Fail, And What To Do About It
Improving reliability in semiconductors is critical for automotive, data centers, and AI systems.
New Challenges In IC Reliability
How advanced packaging, denser circuits, and safety-critical markets are altering chip and system design.
What’s Missing In Test
Different types of test all work, but catching every real and potential issue remains a challenge.
Doing More At Functional Test
New approaches for cutting costs and improving reliability for increasingly complex chips.
Inspection, Metrology Issues In Advanced Packages
How to ensure that chips and chiplets will work as expected inside a package.
Speeding Up Acoustic Wafer Inspection
Why rotational scanning shrinks inspection time in complex chips and packages.
Real-Time Safety Monitoring
How do you know when a safety-critical chip is working properly?
Making Adaptive Test Work Better
How to manage more data efficiently during test.
Overlay Optimization In Advanced IC Substrates
How analytics can improve yield in high-volume manufacturing of panels.
Cost And Quality Of Chiplets
Why adaptive test is becoming necessary in heterogeneous designs.
