Test, Measurement & Analytics

Top Stories

Racing To The Edge
The opportunity is daunting, but so are the challenges for making all the pieces work together.
Published on April 9th,  2019 by Susan Rambo And Ed Sperling

New Approaches To Security
Data analytics, traffic patterns and restrictive policies emerge as ways to ensure that systems are secure.
Published on April 9th,  2019 by Ed Sperling

3D NAND Metrology Challenges Growing
Rising costs and gaps in equipment emerge as technology scales; new tools under development.
Published on April 9th,  2019 by Mark LaPedus

Gaps In 5G Test
Millimeter wave technology will require a whole new approach to ensuring reliability.
Published on March 20th,  2019 by Kevin Fogarty

Finding Defects In Chips With Machine Learning
Better algorithms and more data could bolster adoption, particularly at advanced nodes.
Published on March 12th,  2019 by Mark LaPedus

Domain Expertise Becoming Essential For Analytics
More data doesn't mean much unless you know what to do with it.
Published on March 12th,  2019 by Ed Sperling

Using Sensor Data To Improve Yield And Uptime
Deeper understanding of equipment behavior and market needs will have broad impact across the semiconductor supply chain.
Published on February 21st,  2019 by Ed Sperling

Mapping The Impact Of Heat On Photonics
Thermal effects are difficult to quantify, but they can disrupt optical signals and reduce the lifespan of lasers.
Published on February 12th,  2019 by Ed Sperling

Reliability Becomes The Top Concern In Automotive
Extended lifetimes and advanced-node designs are driving new approaches, but not everything is going smoothly.
Published on February 12th,  2019 by Ed Sperling And Susan Rambo

Chasing Reliability In Automotive Electronics
Supply chain changes, resistance to sharing data and technology unknowns add up to continued uncertainty.
Published on January 15th,  2019 by Susan Rambo And Ed Sperling

More Top Stories »



Round Tables

New 5G Hurdles
Experts at the Table, part 2: Getting 5G standards and technology ready are only part of the problem. Reducing latency and developing applications ...
Published on August 1st,  2018 by Ed Sperling

Preparing For A 5G World
Experts at the table, part 1: Rising costs, massive complexity, and challenges in testing and simulating these devices will require some fundamenta...
Published on July 12th,  2018 by Ed Sperling

More Roundtables »



Multimedia

AI In Chip Manufacturing
How AI with knowledge transfer can significantly decrease error rates and improve test.
Published on January 15th,  2019 by Ed Sperling

Concurrent Test
The growing challenge to do more in the same time window.
Published on December 10th,  2018 by Ed Sperling

Planarization Challenges At 7nm And Beyond
Why it's becoming harder to prepare a wafer at advanced nodes.
Published on December 10th,  2018 by Ed Sperling

ATE Lab To Fab
How to close the gap between the design and test worlds to improve coverage and shorten time to market.
Published on November 5th,  2018 by Ed Sperling

Using DSA With EUV
Why directed self-assembly still has an important role to play at the most advanced nodes.
Published on November 5th,  2018 by Ed Sperling

More Multimedia »



See All Posts in Test Measurement and Analytics »

Latest Blogs

Editor's Note

Preparing For War On The Edge
The tech world is planning for an onslaught of data, but it's far from clear ...
April 9, 2019
by Ed Sperling
Test For The Autonomous Age

How To Manage DFT For AI Chips
AI-specific processors call for design-for-test techniques that boost time-to...
by Rahul Singhal
The Human Machine Interface

How Do I Know? A Machine Told Me So
Emerging machine learning techniques are pushing the boundaries of what compu...
by Judy Davies
Extraordinary ASICs

Chips That See
How to build an artificial eye for less than $2.
March 12, 2019
by Gert Jorgensen
Accelerating Design & Test

MIMO And Phased-Array Antennas For 5G
Combine circuit and electromagnetic simulations for antennas with multiple fe...
by David Vye
Inside Big Data

The 3 Main Obstacles To Zero DPPM And How To Overcome Them
Reducing the rate of defective parts calls for a whole new quality paradigm.
by Randy Hierbaum

Knowledge Centers
Entities, people and technologies explored


  Trending Articles

Making Chip Packaging Simpler

The promise of advanced packaging is being able to integrate heterogeneous chips, but a lot of work is needed to make that happen.

by Ed Sperling and Mark LaPedus

EUV Arrives, But More Issues Ahead

Improvement still needed for uptime, defectivity, line edge roughness and process flows.

by Katherine Derbyshire

Single Vs. Multi-Patterning EUV

Why this choice isn’t as obvious as it might look.

by Mark LaPedus

The 7nm Pileup

Why are so many companies rushing to do 7nm designs?

by Ed Sperling

3D NAND Metrology Challenges Growing

Rising costs and gaps in equipment emerge as technology scales; new tools under development.

by Mark LaPedus

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