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AI/ML/DL
Electrostatic effects
Communication
Architectures
Memory
Packaging
Manufacturing & Test
Power & Performance
Design & Verification
Automotive
Security
AI/ML/DL
Bridging Math & Engineering In ML
How To Ensure Reliability
MLPerf Benchmarks
Making Sense Of Inferencing Processors
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Electrostatic effects
Electromagnetic Challenges In High-Speed Designs
Multi-Physics At 5/3nm
Thermal Impact On Reliability At 7/5nm
Aging Effects
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Communication
How 5G Affects Test
New Challenges In Testing 5G Devices
Ensuring A 5G Design Is Viable
Compressing High-Bandwidth Video
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Memory
GDDR6 Drilldown: Applications, Tradeoffs And Specs
Memory Subsystems In Edge Inferencing Chips
Making Better Use Of Memory In AI Applications
In-Memory Computing
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Architectures
Making Sense Of Inferencing Processors
The New CXL Standard
ML Inferencing At The Edge
Latency Under Load: HBM2 vs. GDDR6
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Packaging
CXL Vs. CCIX
Thermal Challenges In Advanced Packaging
GDDR6 – HBM2 Tradeoffs
2.5D, 3D Power Integrity
The Case For Chiplets
Variation At 10/7nm
The Next Big Chip Companies
Using High-Bandwidth Memory (HBM)
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Manufacturing & Test
Scan Diagnosis
Testing Autonomous And Semi-Autonomous Vehicles
How To Ensure Reliability
Using Digital Twins and DL In Lithography
Using Machine Learning To Break Down Silos
How 5G Affects Test
Inverse Lithography Technology
New Challenges In Testing 5G Devices
Improving Quality Through Data Analytics
Manufacturing Printed Sensors
Process Window Optimization
Changes In Smart Manufacturing
Advanced Process Control
Using ML For Post-Silicon Validation
Making AI More Dependable
AI In Chip Manufacturing
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Power & Performance
Thermal Challenges In Advanced Packaging
Electromagnetic Challenges In High-Speed Designs
Die-To-Die Connectivity
Reducing Data At The Source
Thermal Challenges And Moore’s Law
Where Is The Edge?
Smart NiCs
Inferencing At The Edge
New Challenges For Data Centers
Multi-Physics At 5/3nm
2.5D, 3D Power Integrity
Thermal Guard-Banding
Making Sense Of DRAM
eFPGA vs. FPGA Design Methodologies
Thermal Impact On Reliability At 7/5nm
7nm Thermal Effects (2017)
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Design & Verification
Using Static Analysis For Functional Safety
Bridging Math & Engineering In ML
Challenges In IP Reuse
Distributed Design Implementation
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Automotive
Using Static Analysis For Functional Safety
3 Safety Standards In Auto Electronics
Testing Autonomous And Semi-Autonomous Vehicles
CXL Vs. CCIX
Simultaneous Localization And Mapping (SLAM)
Inferencing At The Edge
Material Choices In Printed Temperature Sensors
Building An Efficient Inferencing Engine In A Car
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Security
Finding Hardware Trojans
IP Security In FPGAs
Holes In AI Security
Meltdown, Spectre And Foreshadow
Complexity’s Impact On Security
HW Security
Biz Talk: ASICS (2017)
Mobile Security Part 2 (2015)
Mobile Security Part 1 (2015)
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