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AI/ML/DL
Electrostatic effects
Communication
Architectures
Memory
Packaging
Manufacturing & Test
Power & Performance
Design & Verification
Automotive
Security
AI/ML/DL
Choosing Memory : HBM2, GDDR6, FeRAM, SRAM, MRAM
Using ML For Post-Silicon Validation
Holes In AI Security
Building An Efficient Inferencing Engine In A Car
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Electrostatic effects
Multi-Physics At 5/3nm
Thermal Impact On Reliability At 7/5nm
Aging Effects
7/5/3nm Signoff
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Communication
5G Design Changes
Chips In Space
5G Test And Deployment
802.11ax: Faster Wireless
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Memory
Choosing Memory : HBM2, GDDR6, FeRAM, SRAM, MRAM
Latency Under Load: HBM2 vs. GDDR6
GDDR6 – HBM2 Tradeoffs
New Memory Options
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Architectures
Latency Under Load: HBM2 vs. GDDR6
The Winograd Transformation
Edge Inferencing Challenges
More Than A Core
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Packaging
GDDR6 – HBM2 Tradeoffs
2.5D, 3D Power Integrity
The Case For Chiplets
Variation At 10/7nm
The Next Big Chip Companies
Using High-Bandwidth Memory
Shrink vs. Package
Analog Simplified
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Manufacturing & Test
Using ML For Post-Silicon Validation
Making AI More Dependable
AI In Chip Manufacturing
Concurrent Test
Planarization Challenges At 7nm And Beyond
Smart Manufacturing
Using DSA With EUV
ATE Lab To Fab
Variation At 10/7nm
Variability In Chip Manufacturing
5G Test And Deployment
Printed Electronics Materials
22nm Process Technology
Defect Reduction At 7/5nm
On-Chip Variation
7nm Process Variation
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Power & Performance
Inferencing At The Edge
New Challenges For Data Centers
Multi-Physics At 5/3nm
2.5D, 3D Power Integrity
Thermal Guard-Banding
Making Sense Of DRAM
eFPGA vs. FPGA Design Methodologies
Thermal Impact On Reliability At 7/5nm
7nm Thermal Effects (2017)
UPF-Aware Clock-Domain Crossing
High-Speed SerDes At 7nm
Aging Effects
In-Design Power Rail Analysis
7/5/3nm Signoff
Electrical Overstress
5/3nm Parasitics
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Design & Verification
Analog Fault Simulation
Verification at 7/5nm
Safety-Critical Coverage
Safety Critical Design In Automotive
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Automotive
Building An Efficient Inferencing Engine In A Car
Analog Fault Simulation
Automotive System Design
Safety-Critical Coverage
Safety Critical Design In Automotive
AI Training Chips
What Is SOTIF?
ISO 26262 Statistics
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Security
Holes In AI Security
Meltdown, Spectre And Foreshadow
Complexity’s Impact On Security
HW Security
Biz Talk: ASICS (2017)
Mobile Security Part 2 (2015)
Mobile Security Part 1 (2015)
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