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AI/ML/DL
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Design & Verification
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AI/ML/DL
Memory Access In AI Systems
Different Types Of AI Hardware
Increasing eFPGA Density
Using ML In Manufacturing
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Electrostatic effects
Ins And Outs Of In-Circuit Monitoring
Electromagnetic Challenges In High-Speed Designs
Multi-Physics At 5/3nm
Thermal Impact On Reliability At 7/5nm
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Communication
Different Levels Of Interconnects
Last-Level Cache
How 5G Affects Test
New Challenges In Testing 5G Devices
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Memory
Ensuring HBM Reliability
DDR PHY Training
High-Performance Memory For AI And HPC
Enterprise-Class DRAM Reliability
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Architectures
eFPGAs Vs. FPGA Chiplets
Big Changes For eFPGAs
Last-Level Cache
PCIe 5.0 Drill-Down
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Packaging
eFPGAs Vs. FPGA Chiplets
Rising Packaging Complexity
CXL Vs. CCIX
Thermal Challenges In Advanced Packaging
GDDR6 – HBM2 Tradeoffs
2.5D, 3D Power Integrity
The Case For Chiplets
Variation At 10/7nm
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Manufacturing & Test
Using ML In Manufacturing
Ensuring HBM Reliability
Cleaning Data For Final Test
Improving IC Reliability And Yield
EDA In The Cloud
Improving Functional Safety In Chips
Scan Diagnosis
Testing Autonomous And Semi-Autonomous Vehicles
How To Ensure Reliability
Using Digital Twins and DL In Lithography
Using Machine Learning To Break Down Silos
How 5G Affects Test
Inverse Lithography Technology
New Challenges In Testing 5G Devices
Improving Quality Through Data Analytics
Manufacturing Printed Sensors
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Power & Performance
Ins And Outs Of In-Circuit Monitoring
Increasing eFPGA Density
Different Levels Of Interconnects
High-Speed SerDes At 7/5nm
PCIe 5.0 Drill-Down
High-Performance Memory For AI And HPC
Enterprise-Class DRAM Reliability
Improving Circuit Reliability
Reliability In Automotive Chips
Where Timing And Voltage Intersect
Tradeoffs In Embedded Vision SoCs
Thermal Guardbanding
How Chips Age
Thermal Challenges In Advanced Packaging
Electromagnetic Challenges In High-Speed Designs
Die-To-Die Connectivity
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Design & Verification
Memory Access In AI Systems
Different Types Of AI Hardware
High-Speed SerDes At 7/5nm
Building A Safety Verification Flow
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Automotive
Who Owns A Car’s Electronics Architecture?
Stream Vs. Pool Data Inferencing
Last-Level Cache
Building A Safety Verification Flow
Improving Circuit Reliability
What’s In Your IP?
Understanding SLAM (Simultaneous Localization And Mapping)
Automotive Chip Design Workflow
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Security
What’s In Your IP?
Finding Hardware Trojans
IP Security In FPGAs
Holes In AI Security
Meltdown, Spectre And Foreshadow
Complexity’s Impact On Security
HW Security
Biz Talk: ASICS (2017)
Mobile Security Part 2 (2015)
Mobile Security Part 1 (2015)
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