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AI/ML/DL
Electrostatic effects
Communication
Architectures
Memory
Packaging
Manufacturing & Test
Power & Performance
Design & Verification
Automotive
Security
AI/ML/DL
Using Machine Learning To Break Down Silos
Simultaneous Localization And Mapping (SLAM)
Making Sense Of ML Metrics
Monitoring Heat On AI Chips
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Electrostatic effects
Multi-Physics At 5/3nm
Thermal Impact On Reliability At 7/5nm
Aging Effects
7/5/3nm Signoff
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Communication
How 5G Affects Test
New Challenges In Testing 5G Devices
Ensuring A 5G Design Is Viable
Compressing High-Bandwidth Video
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Memory
Memory Subsystems In Edge Inferencing Chips
Making Better Use Of Memory In AI Applications
In-Memory Computing
In-Memory And Near-Memory Compute
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Architectures
The New CXL Standard
ML Inferencing At The Edge
Latency Under Load: HBM2 vs. GDDR6
The Winograd Transformation
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Packaging
GDDR6 – HBM2 Tradeoffs
2.5D, 3D Power Integrity
The Case For Chiplets
Variation At 10/7nm
The Next Big Chip Companies
Using High-Bandwidth Memory
Shrink vs. Package
Analog Simplified
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Manufacturing & Test
Using Machine Learning To Break Down Silos
How 5G Affects Test
Inverse Lithography Technology
New Challenges In Testing 5G Devices
Improving Quality Through Data Analytics
Manufacturing Printed Sensors
Process Window Optimization
Changes In Smart Manufacturing
Advanced Process Control
Using ML For Post-Silicon Validation
Making AI More Dependable
AI In Chip Manufacturing
Concurrent Test
Planarization Challenges At 7nm And Beyond
Smart Manufacturing
Using DSA With EUV
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Power & Performance
Thermal Challenges And Moore’s Law
Where Is The Edge?
Smart NiCs
Inferencing At The Edge
New Challenges For Data Centers
Multi-Physics At 5/3nm
2.5D, 3D Power Integrity
Thermal Guard-Banding
Making Sense Of DRAM
eFPGA vs. FPGA Design Methodologies
Thermal Impact On Reliability At 7/5nm
7nm Thermal Effects (2017)
UPF-Aware Clock-Domain Crossing
High-Speed SerDes At 7nm
Aging Effects
In-Design Power Rail Analysis
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Design & Verification
Which Verification Engine When
Visually Assisted Layout In Custom Design
Ensuring A 5G Design Is Viable
Signoff-Compatible CDC
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Automotive
Simultaneous Localization And Mapping (SLAM)
Inferencing At The Edge
Material Choices In Printed Temperature Sensors
Building An Efficient Inferencing Engine In A Car
Analog Fault Simulation
Automotive System Design
Safety-Critical Coverage
Safety Critical Design In Automotive
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Security
IP Security In FPGAs
Holes In AI Security
Meltdown, Spectre And Foreshadow
Complexity’s Impact On Security
HW Security
Biz Talk: ASICS (2017)
Mobile Security Part 2 (2015)
Mobile Security Part 1 (2015)
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