Rising power densities and new architectures are forcing a rethinking of interconnects, materials, and thermal management.
ECTC progress report on enabling technologies, including cooling chiplets, 1µm hybrid bonding, RDL buildups, and co-packaged optics.
New architectures and manufacturing methods draw investors; 75 startups raise $1.9 billion.
$60B fab buildout; Chinese automakers tout 100% homemade chips; 2nm custom SRAM; Cadence’s virtual platform buy; multi-chiplet NoC; HBM roadmap; MIT’s GaN fab technique; 30% tax credit; Taiwan export restrictions, power vulnerability; global memory market; rad-tolerant memory; 2D, non-silicon computer.
AI is accelerating the need for 3D-ICs and digital twins, and causing lots of disruption along the way.
