A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.
New techniques go beyond improved deposition and etching, but challenges stack up, too.
Challenges and options vary widely depending on markets, workloads, and economics.
Panel-level packaging offers scalability and cost efficiency, but meeting advanced node process targets remains a formidable challenge.
But manufacturing reliable 3D DRAM stacks with good yield is complex and costly.
